Industry Directory | Manufacturer
We are a veteran-owned small business that provides end-to-end plastic engineering services including fabrication, forming, machining, bending to create custom plastic solutions from acrylic, abs, pvc, petg, hdpe and more.
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
Suitable for direct connection of solid. stranded or fine standed machine tool wire, as well as with crimped ferrules, pin terminals or tip bonded wire. All products designed in accordance with IEC60947, IEC60079, UL1059, UL486E, CSA C22.2 No.158 sta
Industry News | 2019-01-11 09:23:32.0
PVA is pleased to announce that it received a patent for its optical bonding software. The new software greatly simplifies the bonding process by providing a system that alleviates the guess-work of creating perfect bond sequences from scratch, resulting in less waste and faster time to production.
Industry News | 2019-06-20 06:07:16.0
Yesterday we ship 1*20GP container to our Asian distributor for BGA rework station and COF bonding machine. This is the 2nd container in 30 days for our Asian customers.
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
New Equipment | Soldering Robots
Pulsed Heat HBR/HSC/ACF Bonding System SYSTEM SPECIFICATIONS Dimensions (Without signal tower) 750 mm x 760 mm x 558 mm Weight (Not including the CCD and LCD monitor) 88 Kg
Whatsapp 0086 134 2516 4065 Skype: dzyljy China 2 part ab resin HV components, bushings, insulators potting machine,Motor potting, magnet bonding, Encapsulation of transformers, igniters, noise filters Machine information: Mixing ratio ： 100:
