Full Site - : bonding machine (Page 8 of 81)

Kulicke&Soffa Industries K&S 4124 Wedge Bonder

Kulicke&Soffa Industries K&S 4124 Wedge Bonder

Used SMT Equipment | Semiconductor & Solar

Becoming available soon; K&S 4124 Wire Bonding Machine currently in production to be removed in complete working condition. Contact: Assured Technical Service LLC Minneapolis, MN 55441 AssuredTechnicalServiceLLC@Gmail.com FOB Origin. The

Assured Technical Service LLC

Constant-heated Bonding Machine

Constant-heated Bonding Machine

New Equipment | Soldering Robots

Constant-heated Bonding Machine Model No.: CHB312 Features: 1)Panasonic temperature controller ensures high accuracy heating control. 2)Omron dial knob timer enables easy operation and repeatability. 3)User can setup temperature, time and pres

Plastlist Group

Hot Bar Soldering/Bonding Machine

Hot Bar Soldering/Bonding Machine

Videos

Hot Bar Soldering/Bonding Machine

YUSH Electronic Technology Co.,Ltd

Product Samples

Product Samples

New Equipment |  

Precision IC & Power Mold Parts Precision Trim/Form Tooling (Tool steel & Carbide) Jigs & Fixtures Punches & Inserts Spare Parts For Bonding Machines (Clampers, Cutter, Indexing Finger, Anvil Block etc.) Spare Parts For Machines Stamping Tools/ Dies

Konnlim Precision Tools Sdn. Bhd.

Hot Bar Soldering Machines

New Equipment | Other

We offer a number of soldering machines for bonding Flex to PCB, Connector to PCB and micro cables to PCB/ connectors.

Production Technologies Ltd

SHENZHEN SILMAN TECHNOLOGY CO., LTD.

Industry Directory | Manufacturer

SilmanTech is a One-stop solution supplier of SMT Assembly equipment in China. We offer BGA rework station, Glue dispensing robot, PCB loader/unloader, (AOI) machine, x-ray inspection SMT parts and accessories.Inbox us for more..

NSOP Reduction for QFN RFIC Packages

Technical Library | 2017-08-31 13:43:48.0

Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction

Peregrine Semiconductor

2929 Bondply - Advanced Circuit Laminate

2929 Bondply - Advanced Circuit Laminate

New Equipment | Materials

2929 bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions.  A low dielectric constant (2.9) and loss tangent ( 2929 bondply is compatible with tradit

Rogers Corporation

Siemens 20KV Watercooled RF capacitor

Siemens 20KV Watercooled RF capacitor

Parts & Supplies | ESD Control Supplies

25KV Water Cooled Ceramic Capacitor Manufacturer Supply 25KV 5000pf 2000Kva Water Cool Ceramic capacitor High Frequency RF ceramic capacitor, Watercooled power RF capacitor, RF pot capacitor, water cool capacitor Specifications: Rated Voltage (V)

Shanghai Imax Electronic Co.,ltd

Tabor Electronics TWXF 135285 watercooled RF cap

Tabor Electronics TWXF 135285 watercooled RF cap

Parts & Supplies | Air / Vaccuum

Vishay Draloric TWX, TWXF 135285 Watercooled Power RF-Capacitors (External Cooling) Manufacturer Supply 20KV 5000pf 3000Kva (20KV 6000pf 3000Kva) Water Cool Ceramic capacitor TWX 12KVp to 20KVp TWXF 10KVp to 25KVp Rated Voltage (V): 10KV to 30KV

Shanghai Imax Electronic Co.,ltd


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