Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Industry News | 2016-09-23 15:16:53.0
NEO Tech announced that its highly miniaturized electronic manufacturing capabilities are being deployed in advanced implantable devices and electroceuticals for the medial industry.
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
New Equipment | Board Handling - Storage
BTU: A Leading Manufacturer of High Temperature Controlled Atmosphere Furnaces Thick Film Firing Direct Bond Copper, Brazing, Sintering & Heat Treating Glass-to-Metal Sealing Diverse Atmospheres, Air, Nitrogen, Hydrogen & Forming
Industry News | 2017-07-07 18:49:14.0
Carlsbad, CA. July 10, 2017: Machine Vision Products today announced the appointment of Paul Groome as their manager for the world-wide semiconductor business. The recruitment is part of Machine Vision Products on going strategic plans to improve customer contact and raise market awareness of their industry leading microelectronics, wire bond, semiconductor and packaging Inspection products
Industry News | 2003-05-05 09:13:55.0
Reliable Wire Bonders for High Yield Production
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
Career Center | Manchester, New Hampshire USA | Engineering,Sales/Marketing
We are currently seeking an experienced, energetic and motivated technical sales manager with hands on experience in the semiconductor packaging or microelectronics market. Responsibilities include: Manage all aspects of driving new sales oppo
Industry News | 2012-03-15 09:55:33.0
Carlsbad, CA – March 15, 2012: Machine Vision Products (MVP), a leader in Automated Optical Inspection will be demonstrating its Microelectronics AOI systems applications at Semicon China 2012 in Shanghai from March 20 – 22. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 19 years of service to the industry. MVP will be exhibiting with Teltec SemiconductorPacific Limited at Booth #4435.
