Industry News | 2003-04-16 10:58:03.0
Award presented for Palomar's Gold Connection
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Industry News | 2017-10-05 19:30:49.0
Nordson MARCH will present the paper, Enhancing the Performance of Printed Circuit Board Assemblies Using Plasma Treatment, at SMTA Guadalajara 2017. David Foote, Global Applications Manager, Nordson MARCH, will discuss the fundamentals of plasma treatment. Specific applications and examples will be shown to demonstrate the many uses and benefits of plasma processing for printed circuit board assemblies (PCBAs), including managing electrostatic discharge (ESD) damage.
Industry News | 2018-03-21 20:08:46.0
Nordson DAGE announces the launch of Paragon™ Materials, a new suite of software designed for performing mechanical failure analysis on a range of micro-materials.
Industry News | 2014-03-20 14:21:26.0
COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.
Industry News | 2014-11-07 10:35:14.0
AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.
Industry News | 2013-10-18 07:35:36.0
Tresky announces that iMAPS The 46th International Symposium on Microelectronics, held in Orlando, FL from September 30-October 3, 2013, was a fruitful and exciting show.
Industry News | 2015-07-23 19:58:52.0
EMEA Electro Solutions, headquartered in Barcelona, is taking over Viscom representation in Spain and Portugal. The team from EMEA is the new strong partner on the Iberian peninsula, with 15 years' experience in SMT, THT, microelectronics, ESD products and product finishing. With his long-term experience in the industry and what by now is several years of close cooperation with Viscom, José Luis Pardo, the founder of the company, is a well-known and competent contact partner for customers and other interested persons.
Industry News | 2012-08-29 10:27:05.0
Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.
Industry News | 2014-01-09 10:39:28.0
Engineered Material Systems is pleased to debut its 535-10M-45 UV Cured Epoxy Adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
