Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis
Electronics Forum | Mon Nov 14 02:40:38 EST 2022 | cooper
We are looking for companies in Europe who can provide Samsung mounter installation and after-sales service with generous compensation, interested companies please contact us. Cooper Sales Director Shenzhen Jaguar Automation Equipment Co., Ltd TEL
Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate
Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.
Used SMT Equipment | Pick and Place/Feeders
Flexible Production High PCB handling capacity in a medium speed bonder 510 x 510mm (standard) / 1500 x 460mm (option) - PCBs of 1,500mm(L) x 460mm(W) size can be produced High Reliability Stable mounting of microchips Automatic calibration is perf
Industry News | 2012-08-02 11:15:11.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has strengthened its customer support and wedge bonder representation throughout Northwestern United States and Canada with the appointment of Prospect Technical Sales that will now support the company’s family of wedge bonders in Nevada, Oregon, Washington, Montana, Utah, Colorado, Northern California as well as the Canadian provinces of British Columbia and Alberta.
Industry News | 2012-02-15 20:06:32.0
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region. The Hesse & Knipps Demo and Applications Lab is located at the company’s manufacturer rep - Chalman Technologies - in Anaheim, CA. Hesse & Knipps also maintains an East Coast Demo and Applications Lab in Sterling, MA.
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_microjoin_4100hotbar_bonder.html
microjoin b4100 hot bar bonder Micro Join B-4100 Series Hot Melt Bar Bonder MicroJoin Model Number: B41CVBCA0B0DA00 Serial Number
| https://www.smtfactory.com/Samsung-Pick-And-Place-Machine-Development-History-id40845177.html
: Launched CP-11 high-speed pick and place machine development, launched SWB--100G wire bonder 1996: Launched medium-speed CP--30 high-speed pick and place machine
