Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Parts & Supplies | Pick and Place/Feeders
KE-2060 can place a wide range of components from 0603 and ICs, to odd-form, all at a high rate of speed. 12,500CPH?chip (laser centering/effective tact) 1,850CPH: IC (vision centering/effective tact), 3,400CPH with MNVC option. One multi-nozzle
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
New Equipment | Education/Training
Customize this course by selecting only the days/modules that meet your training requirements. Using both lead and lead-free alloys, Hand Soldering Operator Certification introduces the basics of soldering in Wires & Terminals, Through-Hole and
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Industry News | 2021-02-15 14:41:46.0
– The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.
Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
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