Industry Directory | Training Provider / Events Organizer / Association / Non-Profit
IPC is the trade association for the printed wiring board and electronics assembly industries.
Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
New Equipment | Education/Training
An 8 hour combined lecture, video and hands on session that includes: Soldering techniques for soldering wires to terminals including through-hole components. Identify the different types of solder terminals, connectors, and through hole compone
Electronics Forum | Fri Nov 23 16:09:01 EST 2007 | davef
We're not real clear about what you're trying to discuss, because most capacitors are packaged in epoxy with a solderable termination on each end. But lets throw a couple of ideas at the wall and see what sticks. If this epoxy is: * From the capaci
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Used SMT Equipment | Repair/Rework
● Bottom and top heaters reflow solder to remove components with BGA, gull wing leaded QFPs, and bottom termination components. ●Paste dispenser allows placement of precise paste dots. ● Dual mirror system for component alignment for removal an
Used SMT Equipment | Pick and Place/Feeders
Universal Genesis GI-14 4988F Placement Machine (2009) Brand: Universal Instruments Corporation Model: Genesis GI-14 4988F Product Code: 4988F Year: 2009 Serial #: 10095399 Product Tree #: 49402506 Machine Specifications: Software Version:
Industry News | 2014-10-28 19:14:24.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
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Parts & Supplies | SMT Equipment
03045554-03 S/F-D beam for nozzle removal unit 03045735-03 PCB / CAN NC C+P20 03045754-01 INDUCTOR GR-QS-4-LF 03045848S01 S/F-D launch box 03045883-02 Component reject box S-D 03045909-02 Movable Hood, Left, Complete 03045931-02 Mov
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Parts & Supplies | SMT Equipment
03045909-02 Movable Hood, Left, Complete 03045931-02 Movable Hood Assembly Right 03046203S01 SILICON-HOSE-4,5x2,5x26 03046248-01 add-on kit cable trailing unit 03046282-01 Yello label without inscription 03046331-01 Refitting package SST34 in X-
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2017-07-20 15:18:15.0
As electronic devices increase functionality in smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create issues that may have time delayed effects. One such effect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with moisture, there is the potential for ion mobilization causing current leakage.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC-A-610 Specialist (CIS) Recert.
The Certified IPC-A-610 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-A-610 Specialists.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Career Center | Santa Cruz, California USA | Production,Quality Control
Soldering Technician, Touch-up for PCBAs Perform hand soldering and touch-up rework for Printed Circuit Board Assemblies (PCBA), cables and associated equipment. Inspect PCBA for defects, loose connections, missing components. Solder to perform r
Career Center | , Florida USA | Engineering,Management,Quality Control,Research and Development,Technical Support
Resourceful, innovative professional with over 15 years in the Electronic Industry, with domestic and international experience. Expertise in initiating projects and programs that boost efficiency and productivity while expanding employee education.
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
SMTnet Express, October 23, 2014, Subscribers: 23438, Members: Companies: 14072, Users: 37000 Combination of Spray and Soak Improves Cleaning under Bottom Terminations. Dr. Mike Bixenman; Kyzen Corporation , Julie Fields; Technical Devices Company
SMTnet Express, July 20, 2017, Subscribers: 30,612, Companies: 10,637, Users: 23,528 Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components Bruno Tolla, Ph.D., Jennifer Allen, Kyle Loomis - Kester Corporation , Mike
| https://unisoft-cim.com/rotation-understanding-component-rotations.html
) the top then the bottom side component rotations are rotated clockwise (CW) when the PCB assembly ( PCBA ) is viewed from the bottom
Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-j-std-001-certified-ipc-specialists-cis/
IPC J-STD-001 Certified IPC Specialists (CIS) Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
