Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Sat Jul 06 00:00:00 EDT 2019 - Sat Jul 06 00:00:00 EDT 2019 | Chennai, India
Reliable Electronics for the Automotive Industry Technical Workshop
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Industry News | 2014-10-28 19:14:24.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Industry News | 2021-02-15 14:41:46.0
– The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
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Parts & Supplies | SMT Equipment
03045554-03 S/F-D beam for nozzle removal unit 03045735-03 PCB / CAN NC C+P20 03045754-01 INDUCTOR GR-QS-4-LF 03045848S01 S/F-D launch box 03045883-02 Component reject box S-D 03045909-02 Movable Hood, Left, Complete 03045931-02 Mov
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Parts & Supplies | SMT Equipment
03045909-02 Movable Hood, Left, Complete 03045931-02 Movable Hood Assembly Right 03046203S01 SILICON-HOSE-4,5x2,5x26 03046248-01 add-on kit cable trailing unit 03046282-01 Yello label without inscription 03046331-01 Refitting package SST34 in X-
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