Full Site - : bottom terminations (Page 9 of 34)

Innovations at SMTA Penang

Industry News | 2016-09-16 15:53:13.0

KYZEN is pleased to announce that it will exhibit and present at the SMTA Penang Vendor Show, scheduled to take place Sept. 23, 2016 at the Eastin Hotel Penang. T.C. Loy, KYZEN Sdn Bhd’s Technical Sales Manager, will present the paper authored by Mike Bixenman, MBA, DBA and Jason Chan, entitled, “Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation.”

KYZEN Corporation

QFN Rework Stencil

QFN Rework Stencil

Videos

QFN stenicl bumping process demonstrated using a polyimide stencil. This process is one in which a stencil is used to the bump the bottom terminations of a leadless device making it simple to place without voiding of the the thermal pac or shorting o

soldertools.net

Toronto Expo

Industry News | 2015-04-28 18:03:55.0

KYZEN is pleased to announce that it will present at the Toronto SMTA Expo & Tech Forum, scheduled to take place Thursday, May 21, 2015 at the Hilton Toronto/Markham Suites Conference Centre in Markham, ON. Dr. Mike Bixenman will present the paper titled “How Clean is Clean Enough?”

KYZEN Corporation

Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR

Industry News | 2017-05-22 17:36:43.0

KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum. Bixenman will present the paper entitled, “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach” at 2:30 p.m. on Wednesday, June 7, 2017 at the Edward Village Markham in Ontario.

KYZEN Corporation

Dr. Mike Bixenman to Teach a Workshop on Reliability, Contamination, Cleaning and Process Control during SMTAi

Industry News | 2017-09-05 14:08:01.0

KYZEN is pleased to announce that Dr. Mike Bixenman will conduct a special workshop during the SMTA International Technical Conference, scheduled to take place Sept. 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL. The workshop, entitled “Characterization of Soldering Materials, Contaminants, Cleaning Processes and Process Control for Building Reliable Electronic Assemblies,” is scheduled to take place Monday, Sept. 18 from 1:30-5 p.m.

KYZEN Corporation

Juki JUKI RX-6 Z SLIDE SHAFT ASM 40132660

Juki JUKI RX-6 Z SLIDE SHAFT ASM 40132660

Parts & Supplies | Assembly Accessories

50 EZ7-682-160-01 SCREW +P 4X6 SCREW +P 4X6 (3) 51 EZ7-682-173-01 SCREW +P 5X6 52 EZ7-683-421-04 BOLT HEXAGON SOCKET 4X12 6 53 EZ7-683-435-04 BOLT HEXAGON SOCKET 5X10 6 54 EZ7-688-004-11 W 4 MIDDLE W 4 MIDDLE (3) 55 EZ7-688-005-11 W 5 MIDDLE W 5

ZK Electronic Technology Co., Limited

SIPAD Systems will be in the North Carolina area 2 times in November

Industry News | 2011-10-21 18:13:35.0

The first event is PCB Carolina on November 8th at the Raleigh Convention Center, the second event will be the following week when Matt Kehoe will be speaking along with Dr. Dan Baldwin at the SMTA Carolina Chapter meeting.

SIPAD Systems Inc.

Kester to Present at IPC-SMTA Cleaning and Conformal Coating Conference: Building Reliable Hardware

Industry News | 2016-10-14 16:20:50.0

Kester will be presenting at the IPC-SMTA Cleaning and Conformal Coating Conference: Building Reliable Hardware, which will take place October 25-27, 2016 at the Hyatt Rosemont, in Rosemont, IL.

Kester

Join Murray Percival Co. & Magnalytix for a Technical Webinar

Industry News | 2021-02-18 10:41:08.0

The Murray Percival Company today announced they will be hosting a FREE webinar in partnership with Magnalytix on March 4, 2021, from 1-1:45 p.m. Eastern time.

Murray Percival

Dr. Mike Bixenman to Present during the Technical Conference at APEX

Industry News | 2017-01-30 19:56:21.0

KYZEN is pleased to announce that Dr. Mike Bixenman will present two papers at the upcoming IPC APEX EXPO at the San Diego Convention Center. “Electrochemical Methods to Measure the Corrosion Potential of Flux Residues” will be presented during Session S04 on Tuesday, Feb. 14, 2017 from 1:30-3 p.m. The paper was co-authored by David Lober and Anna Ailworth, KYZEN, and Bruno Tolla, Ph.D., Jennifer Allen, Denis Jean and Kyle Loomis from Kester Corporation. The paper entitled, “Does Cleaning the PCB before Conformal Coating Add Value?” will be presented during Session S20 on Wednesday, Feb. 15, 2017 from 1:30-3 p.m. The paper was co-authored by Mark McMeen and Jason Tynes, STI Electronics, and Gustavo Arredondo, ParaTech Coating.

KYZEN Corporation


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