Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70
Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f
Electronics Forum | Thu May 14 15:51:24 EDT 2009 | dnachristen
I've gone round and round on this very subject with our manufacturing engineer. He prefers to use panel fiducials and I prefer board fids. I've seen the result in placement from bowed PCB's in the machine. Skewing the board a fraction will throw off
Electronics Forum | Thu Jul 08 09:29:10 EDT 2010 | mb_mfg
There are several things that can be done. Shortening the lead length should eliminate bridging between lead. We had done a project several years ago where the customer had shortened the leads to almost flush to the board, preventing any chance of
Electronics Forum | Thu May 17 09:20:10 EDT 2012 | stentech
there are many reasons why FG and Nano are used and many papers written on them. Nano ssems to be the topic of interest right now. I agree it is mostly for printing fine and untra fine pitch. With that comes under stencil wiping to keep the stencil o
Electronics Forum | Tue Aug 28 08:28:30 EDT 2012 | rgduval
We agree with all of the previous comments, and would add the following: Warpage is generally caused by excess moisture in the raw boards. Have you tried baking the boards prior to assembly? We had this issue on a simple 4-layer board, and found t
Electronics Forum | Mon Dec 22 13:54:25 EST 2014 | proceng1
My customer made a process change to overcome a design flaw. The PCB assembly mounts in a plastic housing. The PCB mounts to the front housing via plastic stand-offs. They had to change a connector on the back side of the assembly due to long term
Electronics Forum | Wed Oct 11 21:55:27 EDT 2017 | action_101
I've used plenty of weights in the wave solder process, but not in the SMT reflow process. Ask yourself some why's.... such as why is the part lifting at one end? (board bowing possibly), why? Not the correct tg material or issue with oven profile? W
Electronics Forum | Wed Apr 24 13:49:19 EDT 2019 | griinder
I have a support question concerning setting the gridlock tooling in manual mode on a MPM Momentum Elite. I am printing the top side (bottom is populated with parts) of a thin, flimsy PCB. The Grid lock tooling bows the PCB upwards in Auto mode, beca
Electronics Forum | Fri Jul 24 13:41:05 EDT 1998 | Bob Willis
Sorry guys have a look at this list of component weights and then work out the surface area of the lead/pad and then come back on the PLCC issue. Chip 0805���� 0.007g������ 2 Chip 1206���� 0.009g���� 2 Chip 1210���� 0.012g���� 2 SOT23���������0.008g�
Electronics Forum | Tue Sep 12 11:55:30 EDT 2000 | Mike F
In general I agree with Dave and Chris, but some parts have leads that can't be clinched (connectors, some header sticks, etc.). If the problem part has not been a floater in the past, then check the lead finish and your flux application. A bad finis
