Full Site - : break off (Page 14 of 31)

Mydata Mount Tools

Electronics Forum | Wed Jan 02 12:15:44 EST 2002 | pteerink

Don't waste your money on T&R feeders for large parts. I used to have an old TP9 and we ran tons of products with vibe tubes and odd shaped parts. Used to cut our own tubes for parts and jimmy-rig parts like crazy to make them all fit on the machine

Re: SMT component placement

Electronics Forum | Thu Feb 04 21:17:41 EST 1999 | Chris G.

| What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ? | IPC states: 50% off pad for class 1 and 2 25% off

Dye Pry test

Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette

I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho

BGA solder joint integrity

Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain

Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly

Solder wave shutdown

Electronics Forum | Thu Jun 07 14:17:55 EDT 2007 | mfgengr

Thank you ChrisW. I agree completely. The decision to idle the temperature or turn the wave off is primarily a function of machine utilization. Period. The utilization % break even point for idle vs. turning the heat off is calculated by comparing th

Reflow Profile Design

Electronics Forum | Fri Jun 15 22:00:23 EDT 2007 | grantp

Hi, Thanks for the reply guys, and this is interesting information. I had assumed that if we had a paste spec, and this was the spec for the solder to reflow correctly, then if I achieved that spec, the solder should perform correctly. However this

SMT component placement

Electronics Forum | Thu Feb 04 06:50:35 EST 1999 | Greg Flynn

What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ?

Re: SMT component placement

Electronics Forum | Thu Feb 04 09:09:11 EST 1999 | Peet

| What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ? | We use 50% for civile application, and 25% for mil

Rework units with parylene coating

Electronics Forum | Wed Jun 08 13:06:36 EDT 2005 | jimby

You will have to machine the part off down to the top of the balls. Wick solder off from individual sites one at a time. All that will be left is Parylene shell where balls once were. Take an orangestick and alcohol to break up and remove. Tricky par

Quad 4C laser align calibration

Electronics Forum | Thu May 26 15:13:47 EDT 2016 | bobpan

If there is dust (on the glass) off from the center of the lens it will add it to the part when scanning it and place off. I have ran into this twice.....I fixed it once by breaking the lens on the quad align and blowing it out.....another time I hel


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