Electronics Forum | Wed Apr 29 17:43:14 EDT 2009 | smt_guy
I have a Product with 2 Different PCB Fiducial allocation in the Design. It has 4 Fine Pitch components. The first PCB DO NOT have Fiducial Mark on the board itself BUT has Fiducial on the Break-OFF Tabs. The second PCB has no Break-Off Tab but has f
Electronics Forum | Mon Jan 24 06:19:04 EST 2011 | fönsi
Hello! I've had the same problem about one Jear ago. We had exessive building of voids in the solder joints. I recomment to take a pincer to break off some of the components. If the solder joint is good, the copper pad will stay at the solder joint
Electronics Forum | Tue Mar 22 03:23:10 EST 2005 | EA
Hi, We are trying to break a component ( SMT component ) off the printed circuit board and measure the quality of the solder joint. But, after breaking off and having the reading, we do not know whether the reading is it within the component specifi
Electronics Forum | Wed Dec 11 11:11:59 EST 2002 | Randy Villeneuve
Lead in pencils is conductive, so if dust or lead particals were to break off (which they could easily do) this could cause shorts on the board, etc. Its common practice not to use lead pencils in electronics manufacturing.
Electronics Forum | Thu Jun 02 14:50:41 EDT 2005 | techknow..
Placement looks good...paste to pad coverage good..correct profile used and verified by tracker. The problem being that this one cap is tombstoning at the same place every time. The placement is central. The part is near the edge at the break off.
Electronics Forum | Wed Nov 09 11:18:39 EST 2005 | Beef Kakes
Cracked components will occur when the component is stressed. The only way to stop this is to not stress the part when removing the score. This can be done by fixturing the board top and bottom so it doesn�t bow when breaking off the breakaway. Vi
Electronics Forum | Thu Nov 03 07:43:52 EST 2005 | davef
Questions are: * Is the problem 'wire bonds that don't stick' or 'wire bonds that fall or break off later'? * What materials are you working with? * What is your working time after plasma clean? * What does surface analysis tell you about surface con
Electronics Forum | Wed Jan 23 13:48:06 EST 2008 | flipit
You can do a destructive test to sort of check your process. Break off the flipchip and look for voids. I have used Namics 8437-2 for the last 7 or 8 years. Good stuff. Flows under a 0.001" gap with no voids. Chris
Electronics Forum | Thu Aug 27 16:03:20 EDT 2009 | jim_n_hky
We recently had a very similar issue with BGA breaking off at the pad. We sent samples to a lab for SEM / EDX and they found that there was no intermatalic with the nickel, or very little do to high phosphorus. I recommend you get a board to a lab AS
Electronics Forum | Tue May 18 12:01:29 EDT 2010 | davef
We throw the break-off tabs in the scrap board bin. If your tabs have metal content, metals recycling firms will probably take them. Most tabs have no metal content.
