New Equipment | Assembly Services
Digicom Electronics' ROACH (Reconfigurable Open Architecture Computing Hardware) system was developed with major universities and research labs throughout the world. The ROACH system takes the baseband data from the most powerful radio telescopes, c
New Equipment | Cable & Wire Harness Equipment
Overview The UniStrip 2300 programmable stripping machine strips wires ranging in size from 0.03 – 6 mm² (32 – 10 AWG) and jacketed cables up to 5.5 mm (0.22“) in diameter. This innovative machine does not require any mechanical adjustments to proce
Vice President of Product Management, Pete Doyon providing a demonstration of Schleunigers UniStrip 2300 and the PowerStrip 9550 MR at WPE
Technical Library | 2019-09-11 23:33:04.0
There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling.
The LPKF MicroLine 1000 S is perfect for cutting break-out tabs and complex contours at highest accuracy. The benefits include shorter time to market and much higher quality cuts than conventional methods. The machine's UV laser is an optimal tool fo
Industry News | 2016-01-06 11:10:25.0
Ucamco published revision 2016.01 of the Gerber Format Specification. This revision adds new attributes for castellated holes (or PTH on the board edge) and for tooling and break-out holes.
Laser Depaneling of Populated PCBs Low Cost Option for Depaneling Inexpensive Entry into UV Laser Processing The LPKF MicroLine 1120 S is perfect for cutting break-out tabs and complex contours at highest accuracy. The benefits include shorter
Performance 2000 Web is an Application Services Provider (ASP) of fully integrated, closed-loop performance management tools that deliver critical information about all aspects of a company�s sales, marketing and channels operations. Performance 2000
New Equipment | Cable & Wire Harness Equipment
Overview Schleuniger's most versatile stripping machine, the UniStrip 2600 can process many unique applications and wire & cable types, including discrete wire from 0.03 mm² up to 16 mm² (6 - 32 AWG), power cords (even multiple-conductors with diffe
Schleuniger's most versatile stripper, the UniStrip 2600 can process many unique applications and wire & cable types, including discrete wire from 6 - 32 AWG (0.03 mm² to 16 mm²), power cords (even multiple conductors with different lengths, all in o
