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WE SUPPLY 91,682 PARTS TO 55,681 CUSTOMERS OVER 165 COUNTRIES Moore Automation specializes in industrial automation and offers a wide range of brand's components for Including PLC system, servo drive, HMI, touch screen, motor, CNC
The SP28P-D Screen Printer delivers the capabilities to meet the electronic manufacturing challenges of today and tomorrow-all at a considerable cost savings.
New Equipment | Test Equipment
For over 40 years the Benchmark for Ionic Contamination Testing Commonly referred to "Cleanliness Testing" as this test method has, for over 40 years, been acknowledged as an important Quality Assurance and Process Control tool in the manufacture of
Electronics Forum | Mon Aug 04 10:59:58 EDT 2003 | caldon
Hi Wayne- You may want to contact Brian Toleno at Loctite. Brian Chairs the IPC Conformal Coating Committee for IPC. Brian can be contacted at brian.toleno@loctite.com Regards, Cal
Electronics Forum | Wed Nov 08 19:49:41 EST 2006 | davef
Dr. Brian Toleno wrote that section of the posting that I pasted onto the forum. Try: * �Lead-free Soldering Backward Compatibility�, Pan, et al., IPC/JEDEC Pb-free Conference, San Jose, 2006 * Checking with http://www.ipc.org * Contacting Jianbia
Industry News | 2003-04-01 08:13:08.0
The Introbotics equipment boosts controlled impedance testing productivity and accuracy by a factor of ten compared to the handheld probing techniques.
Industry News | 2003-05-19 09:16:12.0
Labtech will be exhibiting at the 2003 IEEE MTT-S Exhibition
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2008-10-01 14:02:27.0
This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective areas and patterns. A system to obtain homogeneity of the solid-fluid mix is described and results are shared.
Commonly referred to "Cleanliness Testing" as this test method has, for over 40 years, been acknowledged as an important Quality Assurance and Process Control tool in the manufacture of electronic circuit boards, components and assemblies. The Conta
Events Calendar | Wed Apr 08 00:00:00 EDT 2020 - Wed Apr 08 00:00:00 EDT 2020 | ,
Wisdom Wednesday Webinar: Building Synergies in Power Electronics
Events Calendar | Wed Jun 07 00:00:00 EDT 2023 - Wed Jun 07 00:00:00 EDT 2023 | Indianapolis, Indiana USA
Indiana Chapter Technical Presentation and Networking Event: Batteries, Baseball & Beer
Career Center | Somerset, Kentucky USA | Engineering,Quality Control
Focus of position is board level quality, layout design, optimization and customer technical service. Individual will be expected to "do what it takes" to accomplish job objectives without regard to traditional departmental and functional bound
Career Center | , | Sales/Marketing
Sales Engineer/Manager/Representative in electronics and publication/newspaper industries
Career Center | Gainesville, Georgia USA | Production,Quality Control
�Strong mechanical background in building computers and systems. �Experienced in soldering, assembly, and quality control techniques. �Familiar with ISO 9001:2000 certification standards. �Experienced with computer, cable, mechanical and electronic a
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page Book Review by Brian Ellis Title: An Engineer's Handbook of Encapsulation and Underfill Technology Author
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/contact-nordson-adhesives/nordson-representative-us-only/illinois
+ Southern Illinois Brian Wyskochil +1.630.362.0004 Northern Illinois (excl. Chicago Metro South) Regional Sales Managers Rob Girvin +1.216.402.6569 Northern Illinois Brian Dickerson
Surface Mount Technology Association (SMTA) | https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=4
408-234-9485 KevinM@Captec.net Back to Top Our Chapter Leaders Contact the leadership team! President : Jasbir Bath (Bath Consultancy) Vice President : Kevin McClay (Captec) Secretary : Nick Iwata (ZESTRON Americas) Treasurer : Brian Douglas Carey (Innovative Capital Resources NC, Inc
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