Electronics Forum | Fri Nov 11 20:41:58 EST 2005 | GS
Thank you Davef, If I am not wrong in understanding, your answer is mainly related to the Legal point of view according to several different Countries who adopted Rohs or equivalent. My question, sorry for my poor English, is mainly related to the
Electronics Forum | Mon Oct 25 21:28:38 EDT 1999 | Dave F
3%) concentrations of gold form brittle intermetallic compounds with the tin in your solder. Electroless gold is applied with an autocatalytic process that self-limits around 5 mils thickness. You're correct electrolytic gold is used for goldfinger
Electronics Forum | Fri Nov 12 08:55:43 EST 1999 | Wolfgang Busko
Hallo Edmund, what does dull mean in your case ? It�s nearly impossible to say something about it without more information. Dull or shiny isn�t a clear or better no indicator for good or bad. Some companies add other metalls to the solder to get rid
Electronics Forum | Wed May 12 10:29:25 EDT 1999 | Timothy O'Neill
| | | Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | | | I do not think there is a "typical" post reflow cooling rate
Electronics Forum | Mon May 10 15:49:52 EDT 1999 | Steve Gregory
| | Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | | I do not think there is a "typical" post reflow cooling rate out
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Wed Aug 27 08:06:43 EDT 2008 | davef
Thick, hard conformal coatings of acrylic, urethane and epoxy have a well documented history of causing solder joint cracks and breaking glass/ceramic and other brittle components. Dissimilar expansion and fairly high surface bond strengths of the ma
Electronics Forum | Wed Aug 10 10:41:23 EDT 2005 | patrickbruneel
Bob, Great theory if you're selling SN100C, but I have to disagree that an alloy being 4�C off eutectic will cause cracks. When a solder joint exits the solder wave, there is an immediate drop in temperature of 100�C. so being off 4�C is irrelevant.
Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef
What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt
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