Technical Library | 2023-11-20 17:30:11.0
Summary for today 1. Electronic component inspection and failure analysis. 2. Component counting and material management. 3. Reverse engineering. 4. Counterfeit detection. 5. Real-time defect verification. 6. Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D x-ray inspection. 7. Design for manufacturing (DFM) and design for x-ray inspection (DFXI). 8. Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC). 9. Artificial Intelligence and x-ray inspection
Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's utilizing lead-free alloys that seem to require a blow-torch to solder effective
Let the HR 550 guide you through your rework task! A combination of instructive pictograms, computer aided placement and effective hybrid heating makes rework of BTC (Bottom Terminated Components) a breeze. Find our products ? http://www.kurtzersa.co
Higher, faster, further! And also bigger: Ersa HR 600 XL – the ultimate solution for professional big board rework up to 24 x 24 inches. See the capabilities and flexibility of this exciting machine. More about HR 600 XL ? https://big-board-rework.de
Industry News | 2014-02-21 12:50:41.0
Kyzen today announced that Mike Bixenman, DBA, CTO, and David Lober will present at five separate technical sessions at IPC APEX EXPO in Las Vegas in March.
Industry News | 2013-04-08 13:46:37.0
Kyzen Corporation announces that Debbie Carboni will present “Removal of Flux Residues from Highly Dense Assemblies” at IMAPS NE 40th Symposium & Expo on Tuesday, May 7, 2013 at the Holiday Inn Conference Center in Boxborough, MA.
Industry News | 2011-10-21 18:13:35.0
The first event is PCB Carolina on November 8th at the Raleigh Convention Center, the second event will be the following week when Matt Kehoe will be speaking along with Dr. Dan Baldwin at the SMTA Carolina Chapter meeting.
Industry News | 2019-10-24 16:25:40.0
Kurtz Ersa Inc. announces that it was awarded a 2019 Mexico Technology Award in the category of Rework and Repair for its HR 600 XL-L. The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
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