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Allen-Bradley 1771-HS3A IMC-123 3 Axis Servo Controller

Allen-Bradley 1771-HS3A IMC-123 3 Axis Servo Controller

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials

How Much is a Central Air Conditioner - Prices of Different Types of Central Air Conditioners

Industry News | 2021-10-28 21:21:44.0

A quote of a central air conditioner consists of the following prices: equipment (outdoor unit & indoor unit) + materials + installation cost + maintenance cost.

OKmarts Industrial Parts Mall

ABB AO810V2 Analog Output Module

ABB AO810V2 Analog Output Module

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Demand for Consumer Electronics to Boost Asia's Leadership in Electronics Manufacturing

Industry News | 2008-09-16 13:38:48.0

SINGAPORE, 16 September � According to the Consumer Electronics Association (CEA), global consumer electronics revenue is projected to grow by almost 10% in 2008 to reach a staggering $700 billion. The continuing strength in the electronics manufacturing sector as a whole in emerging markets in the Asia-Pacific region is providing a level of resiliency that ensures the demand for new technology remains robust. GlobalTRONICS 2008 will be a choice platform for industry professionals and analysts to congregate and share ideas on how to ride on the wave of demand.

Reed Exhibitions - RX (Reed Exhibitions)

A new paradigm in soldermask exposure - ACB leads the field with LED-based Direct Imaging

Industry News | 2013-11-08 17:12:39.0

ACB is Europe's leading manufacturer of quick-turn and high-reliability prototype and small series PCBs. Typically an early adopter of new and enabling technologies, the company recently took delivery of a top-of-the-range LED-based Direct Imaging (DI) system from Ucamco. Manufactured by Dainippon Screen, Ledia 5 is the PCB industry's fastest DI system, and the only one capable of processing standard soldermask: unique capabilities that, together with ACB's trust in its suppliers, were key to the company's latest investment decision. Working alongside ACB's existing Laser DI system, Ledia 5 handles all ACB's soldermask processing and provides added capacity for dry film exposure. With it, ACB is more flexible and has improved its product quality, yields and capabilities while offering shorter leadtimes for its quick-turn business.

Ucamco

Treading on dangerous ground

Electronics Forum | Wed Jul 22 13:50:49 EDT 1998 | Justin Medernach

| My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board

Chip Components with big ground pads - Unsolder

Electronics Forum | Mon Jan 26 03:45:37 EST 2004 | Vinny

Hi All, We are producing a veriety of RF related PCBAs in which we see Unsolder/Mislaigned on a regular basis. In these baords usually one of the pad is connected to a signal trace and the other pad is connected to very huge ground plane. This gro

Chip Components with big ground pads - Unsolder

Electronics Forum | Mon Jan 26 04:13:48 EST 2004 | patthemack

First of all, did you profile this board with a mole, such as a KIC? Is the solder flowing, or just not wetting to the part or pad? I work with RF boards as well, but the main problem is tombstoning due to the ground plane side being larger because o

Chip Components with big ground pads - Unsolder

Electronics Forum | Wed Jan 28 20:58:16 EST 2004 | davef

Vinny: From a thermal standpoint, your choices are: * Get your customer to design thermal relief in the board. * Set your thermal recipe to assure that the grounded pad reaches reflow temperature. This may require a long soak at a single temperature


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