Electronics Forum | Tue Apr 30 10:14:43 EDT 2019 | SMTA-Joe
I wish I had that much power! They're always going to select components according to their needs, but I want to know if there are standard pad layouts (complete size/shape) that are shared between components so I can re-use some screens for multiple
Electronics Forum | Fri Mar 15 15:51:26 EDT 2013 | rway
Is this for something permanent? Where is the ground pad located (mid-bank, bank-end etc.)? What is the lead pitch? Are you looking on rerouting this pin some place else? Can you provide a picture of the pad in question?
Electronics Forum | Mon Nov 12 19:02:48 EST 2012 | jmartens1978
My first attempt was similiar to that. It was a straight ground trace running past the circular pads that were recieving the shocks. It was hit and miss when the arcs would occur. When I cut notches in the trace so the ground line had a point next to
Electronics Forum | Tue Aug 05 17:19:55 EDT 2003 | csimfgeng
Another variable is whether the ground pads have proper thermal reliefs. If the pad has solid ground plane around the perimeter, the heat being applied will quickly dissipate to the surrounding metal. A proper relief of the pad will prevent the hea
Electronics Forum | Thu Apr 01 12:31:39 EST 2004 | russ
one more thought on this, When these boards are built new do we not have solder paste on the ground pad and then reflow? Has this caused any misregistration for you? I am assuming that you are not pasting the leads with the ground pad correct? I
Electronics Forum | Thu Apr 01 11:27:17 EST 2004 | Jimmy
I have some fine pitch QFP's to rework with our smt rework system (forced air). There are no intitial concerns in removing the component (we havent actually begun the rework process) however, installing a new chip presents a problem. The QFP has
Electronics Forum | Mon Sep 23 09:55:12 EDT 2013 | emeto
Hi, just for the package you have you will see 20 different designs for the ground pad. Some will be 1:1 with the part some will be 3 times bigger than the part ground contact. I would always print according to the part and will always do a windowpa
Electronics Forum | Thu Jul 20 23:41:55 EDT 2017 | heros_electronics
Below is an email that I copy and pasted from my customer's engineer about his concerns with the issue of the chips not reflowing (which is why I was asking about X-ray the chips to make sure they reflowed): Can you let me know your thoughts on his
Electronics Forum | Mon Aug 31 22:30:09 EDT 1998 | Kelly Morris
We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. Our pad design is .020" diameter pads with .025" solder resist diameter. The center
Electronics Forum | Tue Sep 01 19:16:51 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
