Metcal's new MX-500 Soldering and Rework System has been reimagined, adding features and a new look to a bench top icon. Built upon SmartHeat™ Technology, the new MX-500 assures extremely responsive and highly controlled heating delivering the exact
Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
Used for Coaxial measurements. The probes are 50 ohm impedance and the ground shield extends to test pad. Patented Design
Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's utilizing lead-free alloys that seem to require a blow-torch to solder effective
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Used SMT Equipment | In-Circuit Testers
Megger DET2/2 Digital High Sensitivity Ground Resistance Tester Megger DET2/2 (250202) Auto Earth Tester is a robust compact instrument designed for measuring earth electrode resistance and soil resistivity. It uses the four terminal method of
Used SMT Equipment | In-Circuit Testers
Megger DET2/2 Digital High Sensitivity Ground Resistance Tester Megger DET2/2 (250202) Auto Earth Tester is a robust compact instrument designed for measuring earth electrode resistance and soil resistivity. It uses the four terminal method of
Used SMT Equipment | General Purpose Test & Measurement
Megger DET2/2 Digital High Sensitivity Ground Resistance Tester Megger DET2/2 (250202) Auto Earth Tester is a robust compact instrument designed for measuring earth electrode resistance and soil resistivity. It uses the four terminal method of
Used SMT Equipment | In-Circuit Testers
Megger DET2/2 Digital High Sensitivity Ground Resistance Tester Megger DET2/2 (250202) Auto Earth Tester is a robust compact instrument designed for measuring earth electrode resistance and soil resistivity. It uses the four terminal method of
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