Industry News | 2015-04-21 17:10:49.0
Saki Corporation will demonstrate its BF-3Di automated optical inspection and BF-3Si automated solder paste inspection systems at SMT Hybrid Packaging, Nuremberg, Germany, May 5-7 2015, in Stand 7-331.
Industry News | 2016-03-01 13:33:18.0
SAKI America will demonstrate its 3rd generation 3D automated optical inspection system at IPC APEX 2016, booth 1860. Saki's new 3D AOI, BF-3Di-Z1, accommodates XXL board sizes, offers dual-lane configurations, optional side angle cameras, and increases throughput by 15%. The 3D AOI system provides measurement of components with a height range from 0-20mm, achieving 1-micron height resolution, a false call rate of
Industry News | 2016-03-21 13:27:53.0
Barry Industries announces the introduction of an ultra-broadband, DC to 60GHz chip termination for microwave applications. The uniquely designed TV0404FA-50R0JN-91 has been third-party tested to show a typical return loss of 18.5dB or better over a DC to 60GHz bandwidth.
Industry News | 2016-08-28 13:28:32.0
Saki Corporation will demonstrate its 2D and 3D automated optical inspection (AOI) systems at NEPCON South China in booth 1G35. Saki's AOI systems' unique Phase Measurement Profilometry technology and quad-directional side cameras inspect and measure QFNs, J-leads, and connectors, and enable the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations, without a reduction in speed. NEPCON South China is being held August 30-September 1, 2016 at the Shenzhen Convention & Exhibition Center, Shenzhen, China.
Industry News | 2016-09-22 18:12:16.0
Saki Corporation will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.
Industry News | 2024-05-13 10:19:11.0
SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2003-09-02 13:19:51.0
www.bravaviewer.com
Industry News | 2007-11-01 01:45:16.0
LITTLETON, MASS. - VJ Electronix Inc., the leader in X-ray inspection technology and rework systems, announces that it will display the Summit 1100HR high-performance, semiautomatic rework system in their distributor, Ryonics� Stand 324 in Hall A5 at the upcoming Productronica 2007 trade show and exhibition, scheduled to take place November 13 to 16, 2007, at the Munich Trade Fair Center in Munich, Germany.
.gif)
.png)
