Electronics Forum | Wed Aug 07 15:58:17 EDT 2024 | SMTA-64386252
Hello. Since a DFN is a BTC component, an end fillet height is not required on IPC 610 since most of these components did not have a wettable surface on the sides. A cross section in a non-touched up sample could be performed to validate the solder
Electronics Forum | Thu Sep 09 05:23:10 EDT 2010 | 15009
You can reduce and almost eliminate voids and other paste related defects in LGA's BGA's, QFN's etc, by using solid solder deposit. Its been around for 24 years, 13 in the US. It is now included in the new IPC 7093 specification for bottom terminat
Electronics Forum | Wed Dec 11 07:05:28 EST 2019 | ameenullakhan
Hi, Below may help you out. per IPC 7093 ( Design and assembly Process Implementation for Bottom Termination Components ),Clause 6.1.5.3 voids on thermal pad up to 50% does not result in loss of thermal performance. Since the void criteria is
Electronics Forum | Fri May 14 16:49:17 EDT 2021 | winston_one
Agree with WiIIR and also can recommend to play with vaccum pump RPM . Slower vacuum increasing have help me to resolve one problem caused by the vacuum (it was solder splash from BGA balls, but the reason can be similar to your case). Also check i
Electronics Forum | Wed Jul 19 12:54:04 EDT 2023 | calebcsmt
Since side fillets are not a requirement for QFNs/BTCs due to some packages not having wettable side terminations, how does one determine if the side terminations are actually solderable/designed for wetting? Is it simply if the side terminations
Electronics Forum | Mon Apr 29 12:45:00 EDT 2019 | slthomas
When you say "....is there a way to easily (or at all) reference parts with the same specs..." do you mean when ordering stencils, or are you trying to drive your designers to choose a package that you already have in play when they have package opti
Electronics Forum | Wed Jul 06 09:07:28 EDT 2016 | davef
Hi Pavel IPC-6012 - Qualification and Performance Specification for Rigid Printed Boards, Paragraph: Solder Resist (Solder Mask) Requirements, Sub-paragraph: Solder Resist Thickness has words to the effect … * Solder mask thickness shall be accordi
Electronics Forum | Sat Dec 02 10:23:47 EST 2017 | tomh
Have you ever heard of "Solder Mask Defined Thermal Pads"? I wrote a short blurb on this here - https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html This technology saves fabrication costs by not havi
Electronics Forum | Mon Mar 11 06:49:42 EDT 2019 | SMTA-Bob
You problem will be related to the part type or the design. Standard 40 or 100 pin QFN or LGA parts are not going to drop due to weight as they are just a few grams. If you send a photo of the PCB pad footprint and the component separately I may be a
Electronics Forum | Fri May 28 13:19:31 EDT 2021 | cbart
I can't see the image very well, but from what i see it looks like oxidation. looks like an ENIG finish on the board, possibly a plating issue from the bare board house, thin gold or the nickle is to thick. one other question i would get an answer t
