Electronics Forum | Thu Sep 23 23:58:01 EDT 1999 | Earl Moon
| | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near-b
Electronics Forum | Mon Sep 27 12:19:19 EDT 1999 | John
| | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near
Electronics Forum | Wed Jun 03 21:25:33 EDT 1998 | John Allan
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Thu Jun 04 08:32:21 EDT 1998 | Dave F
| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints
Electronics Forum | Mon Sep 10 08:40:21 EDT 2012 | donkudner
After selecting a few ovens based on the mfr's specifications, I plan to send them a thermal "slug" to run in their ovens (a 1/4" thick, high temp fiberglass slab with imbedded thermocouples). Since we are replacing ovens with fixed speed blowers wit
Electronics Forum | Thu Oct 12 16:55:19 EDT 2006 | realchunks
This type of testing is only done to verify your reflow process. It is destructive testing and should not be performed on product reaching your customer. Solder is only used to provide the electrical connection from part to board. As a metal it is
Electronics Forum | Sat Feb 20 20:24:40 EST 2021 | sync40
Hello Ameen, It is needed a moderate impact bump to generate skew. Even blowing of the fans generally cannot generate serious skew -unless the pads apertures are not suitable for the components size/weight. You can try for yourself. Take a board wi
Electronics Forum | Tue Oct 10 07:30:19 EDT 2017 | spoiltforchoice
TBH I think perhaps the OP deserved it, there is perfectly good explanation of Reflow and Process Window Index on Wikipedia for starters and if you want more all sorts of FREE specialist papers on things like reflowing flex circuit, lead/lead free et
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Electronics Forum | Mon Jun 28 13:12:34 EDT 1999 | Graham Naisbitt
| | We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff component
