Electronics Forum | Mon Mar 08 20:17:41 EST 1999 | Michael Larsen
| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using
Electronics Forum | Tue Aug 13 10:09:10 EDT 2013 | dyoungquist
We have a Heller 1707EXL that we use for lead and lead-free production. It has both a mesh belt and edge rails. We run 90% of our assemblies on the mesh belt (leaving the edge rails wide open). I have noticed when profiling a board on the mesh bel
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Tue May 18 15:36:18 EDT 1999 | Tony
| | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil,
Electronics Forum | Wed Aug 10 04:15:01 EDT 2005 | vinitverma
Ari, I would suggest you make a checklist of all your requirements (not just large scale production) and prioritize them with weights assigned to each. Fill in the checklist for each equipment and manufacturer and you'll have the results out. I wou
Electronics Forum | Thu Jun 24 19:14:44 EDT 1999 | Mike Konrad
Very good questions Bob� Given the fact that my company is a manufacturer of batch cleaning equipment, I will speak more in general terms rather than in specific terms. There are several criteria used in the evaluation of batch aqueous cleaning sys
Electronics Forum | Tue Sep 28 04:10:26 EDT 1999 | Wolfgang Busko
| | | | | | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shield
Electronics Forum | Tue Sep 28 06:36:35 EDT 1999 | Earl Moon
| | | | | | | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shie
Electronics Forum | Thu Jun 04 12:22:12 EDT 1998 | John Allan
| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo
Electronics Forum | Thu Jun 10 12:10:41 EDT 1999 | Earl Moon
| | | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | | There is anybody has experience on metal-based PCB reflow process?
