Full Site - : btu reflow blowing components (Page 7 of 27)

Blow hole on pad after reflow oven

Electronics Forum | Sun Jan 23 17:26:48 EST 2011 | piter

Hi In my experience try to change component to another batch or anther manufacturer it is very often problem in reflow when components have strange finish

Components randomly wiped out in reflow

Electronics Forum | Fri Mar 23 14:43:19 EDT 2018 | dleeper

What sort of components are missing? One possibility is moisture sensitive parts outgassing during reflow. The jets of steam propel the parts off the PCBA. Another thing to look at is your convection oven fan speeds. On some ovens this is adjustabl

Blow hole on pad after reflow oven

Electronics Forum | Mon Jan 24 06:19:04 EST 2011 | fönsi

Hello! I've had the same problem about one Jear ago. We had exessive building of voids in the solder joints. I recomment to take a pincer to break off some of the components. If the solder joint is good, the copper pad will stay at the solder joint

baking out pcbs after reflow process

Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon

You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com

component aherence force on the solder paste before reflow

Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte

If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at

Reflow Oven vs 0402 Tomb Stone

Electronics Forum | Sun Jun 10 12:15:37 EDT 2001 | procon

Hello Danial, Leave it up to most to blame the relow oven for their tombstoning problems when in fact it is usually the last to cause it. The biggest culprit of tombstoning is the pad design followed by the print quality. Usually, we find that the p

Parts Blowing off in Reflow Oven

Electronics Forum | Wed Jun 29 18:11:13 EDT 2005 | GS

Start from this: - check the air flow speed, if too much it can help to get components moved/blowed away. - Other cause (not so often)it could be moisture in PCB, so when degassing, may be trough vias, the pressure could blow away components. Regar

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Tue Feb 13 05:11:58 EST 2018 | ameenullakhan

Hi, We are using 10+2 reflow oven ( BTU Pyramax 150 ). We have tried with short TAL ( RTS profile too ). As of Now we are using the attached profile, which has given us lot better results. But the issue is not eliminated. Thanks

Re: Double Reflow

Electronics Forum | Tue Dec 28 12:59:34 EST 1999 | Justin Medernach

Edmund, Check your "Air Amp" settings or the equivalent on your oven. Sounds to me like they are probably turned up too high in the reflow zone and you are blowing the components off of the board when the solder goes liquidous. Regards, Justin

Parts Blowing off in Reflow Oven

Electronics Forum | Thu Jun 30 12:27:58 EDT 2005 | kmorris

I'm not familiar with this particular oven, but have seen this problem once before. As it turned out there was a flexible curtain near the end of the reflow tunnel on the oven. Some very fine strands had frayed from the curtain and were catching on


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