Electronics Forum | Thu Jul 14 01:08:30 EDT 2005 | pyramus
I too experience it too component being blown out of the pad also using heller 1800. In my case I also did check entry and exit of reflow so far no obtruction. Also checked profile setting also ok. Mine is a 0603 Chip capacitor... but problem is o
Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland
| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr
Electronics Forum | Wed Aug 26 03:21:00 EDT 2009 | sergey2007
Hi Graham, the MSD level of the component is 3. I am not sure that my customer properly stored the component before the soldering process. And I am not sure that it was dried at all. The customer says they did everything that they had to, but I just
Electronics Forum | Thu Aug 29 15:51:21 EDT 2019 | spoiltforchoice
&gt; If quality or Reliability is the key.... BTU, <BR> &gt; Soltec Vitronics..Rehm... If it is the money <BR> &gt; ...probably not these brands.....:) <BR> <BR> Well I
Electronics Forum | Thu Aug 27 09:18:57 EDT 2015 | fcmtechnician
Hi Don't know your reflow brand, but try to decrease the blower speed...is possible that air blow out the componets! For vibration, chain related issue, etc open your hood and start the oven in colder recipe with pcb inside! ( put the service key o
Electronics Forum | Fri Jun 25 08:44:01 EDT 1999 | Graham Naisbitt
| We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff components
Electronics Forum | Thu Jul 20 16:10:34 EDT 2000 | armintan
Hi Bob, From my memory about almost 4 yrs. ago, I remember we did something similar to this in Apple Computer Singapore. Process sequence are: Bottom Side Process: Print Solder Paste(Dek 265GS) Dispence Adhesive (Cam/Alot 3800) Place Components (
Electronics Forum | Wed Feb 17 12:16:17 EST 2010 | dcell_1t
Hi there: During the past weeks (let's say since beginning of the year) we've been experiencing some issues with shifted components. We verify for position before Reflow oven and the components are Ok, but they observe shifted after reflow. it occurs
Electronics Forum | Fri Feb 03 17:25:47 EST 2012 | tombstonesmt
We've been having issues with our current process of oven profiles. We use a high temp adhesive to bond the thermal couples to the desired components. The issue of them letting go or releasing during reflow temps are hit or miss. Majority of our buis
Electronics Forum | Thu May 28 09:23:59 EDT 1998 | Chrys
| Hello, | | I need some users information about "hot air knife" after the wave | bath: | - Defects reduction ? | - In what kind of boards(TH/SMT SOICS ect.) it is applied ? | - Where can I purchase it as a retrofit (Soltec Delta 6622cc) ? |
