Full Site - : btu reflow blowing components (Page 10 of 26)

Pin hole

Electronics Forum | Thu Mar 11 02:56:01 EST 2010 | grahamcooper22

Hi, blow holes / pin holes / holes in joints are usually a sign that there is excess moisture somewhere around the solder joint. Moisture can be in pcbs / components, so try drying them....a simple thing to do is pass a bare pcb throught your reflow

Blow Holes voids in solder fillet on caps

Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef

Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as

Harwin SM connector problems

Electronics Forum | Thu Jul 28 05:41:22 EDT 2005 | K

Hi guys, Have any of you encountered harwin connector M80-647 in the past? Have you noticed any problems with the reliability of the component, solderability and 'reworkability' (thats a new word for sure)? Heres a PDF of the component; http://www.

Re: Metal based PCB reflow.

Electronics Forum | Wed Jun 09 17:29:59 EDT 1999 | Earl Moon

| I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | There is anybody has experience on metal-based PCB reflow process? I guess

Re: Metal based PCB reflow.

Electronics Forum | Thu Jun 10 11:23:10 EDT 1999 | Gang Pan

| | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | There is anybody has experience on metal-based PCB reflow process? I g

Re: Water Batch Cleaners

Electronics Forum | Sun Jun 27 12:24:43 EDT 1999 | Scott Cook

| We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff components

BGA Contact

Electronics Forum | Thu Jul 25 03:01:25 EDT 2002 | martz

We experience e-test failure due to BGA problem. The product was subjected to 40 deg.C hot air blowing on the BGA area and it works pretty well. The product then failed when the temperature became 36 deg. C as the hot air blower is withdrawn. If it

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Thu Dec 28 16:20:12 EST 2017 | rgduval

Pictures of your issues would help us to help you. Pin holes/blow holes are generally caused by either moisture or flux volatiles/organics. Since you've virtually eliminated moisture, it might be time to look at your paste/flux. You can call eithe

No such thing as a Compact Reflow Oven?

Electronics Forum | Tue Mar 20 03:55:38 EDT 2018 | rob

MTC = Multi tray changer. It's a stand alone unit that feeds in trays of components - it means you don't sacrifice feeder locations to waffle packs. Different companies call them different things. A 760 is dog slow, and spares are getting harder to

0201 caps

Electronics Forum | Tue Dec 03 10:21:11 EST 2002 | jimlew

I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. Here's the answers to your questions: Placement Force: 0201s are placed on the Siemens S23s with 1 newton of force. The s


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