MS-T02 Conductive bag Surface resistance:��104-106�� MS-T03 ESD lattice bag Surface resistance: ��104-106�� MS-T04 ESD and moisture-Proof vacuum packing bag Surface resistance����1011�� MS-T05 ESD PE bag Surface resistance:��1011�� MS-T
Our Bio-Tech Services division provides processes on a contract basis to companies engaged in the design and manufacture of various types of microfluidic devices. Our typical client is an R&D group looking for fast turn micro fabrication services fo
New Equipment | Solder Materials
Fluxes for use with Tin/Lead Solder. EQ-392 No-Clean is a homogeneous mixture of halogenfree, low solids organic flux designed for wave-soldering conventional and surface mount PCB assemblies. EQ-392 provides superior foaming characteristics with a
Industry News | 2017-02-01 20:14:51.0
Seika Machinery now carries the SAWA PIBW-T100L Bubble Washer System. The system provides effective cleansing with the surface active agent-free electrolysis water and eco-friendly SAWA Pica SNW-H20 alkaline solvent.
Parts & Supplies | SMT Equipment
Supply all juki spare parts at lower price. HX002140000 JUKI POWER SUPPLY (+24V 2.1A) WS0410002UZ JUKI SPRING WASHER E3025729000 JUKI GUIDE SHIM C JUKI 40055681 YB PULLEY BRACKET R ASSY(N) ESS12057100 JUKI AC SERVO MOTOR XY (R88M-U400) ESR14033
Cherng Horng mainly manufactures blown film machine, film extrusion machine, flexo printing machine, plastic bag making machine, stretch film rewinder machine and agricultural blown film machine.
Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
Used SMT Equipment | In-Circuit Testers
Furukawa S175 Fusion Splicer The Furukawa-Fitel S175 is the fastest, the smallest and the easiest splicer among the world's direct core monitoring machines. It is so easy to use that the splicer automatically analyzes the fibre type from Single
Industry News | 2014-07-06 12:48:55.0
If you have problems with voids in area array packages or bubbles in conformal coating? Lets fix these together in September at SMTA International. There are many different reasons why some defects occur so lets look at the common reasons and see which is your best solution.
Technical Library | 2021-08-11 01:00:37.0
Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.
