Electronics Forum | Wed Nov 25 15:16:04 EST 2009 | sforman1
Why in heavens name are you using a heat or air cure conformal coating. Why aren't you using a 100% solids UV cure system. You would never have an issue like this Sam Forman MicroCoat Technologies
Electronics Forum | Sat Jul 11 03:01:29 EDT 2020 | researchmfg
The bubble inside BGA ball locate at via in pad and apply the resin plug hole.You shall check the cooper plating quality on PCB pad. If there is thin plating or broken on the pad then air will come from the resin plugged via and be trapped inside the
Electronics Forum | Mon Mar 27 21:09:29 EST 2006 | ms
Thanks Dave I'm not convinced the air is necessarily in the paste from manufacture - suspicious that it may be folding in during the change in direction of the print cycle - or as the paste travels across apertures. It is not necessarily in the fir
Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef
Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we
Electronics Forum | Fri Dec 18 09:07:24 EST 2009 | tommyg_fla
dave, where I work they are having the same problems with 1B31 acrylic. The coating thickness is 6-8 mils dried so that have to do several passes with an air dry between them and a final oven cure. They think that it might be related to the heating r
Electronics Forum | Mon May 16 18:03:30 EDT 2005 | davef
Key Issue: Will this machine solder your boards? You never know until you solder one. Any other avenues of analysis involve substantial risk. Flux Selection * High or low solids * VOC or VOC-free Solder Alloy * If using lead-free, avoid stainles
Electronics Forum | Tue Nov 03 16:28:21 EST 1998 | Dave F
| Well my process is I'm running my belt speed at 3.50fpm and about 215 to 225 degrees top side. I got my main wave down to a little less than half the board thickness. I'm not using a hot air knife cause we thought it might create more of a problem
Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
Electronics Forum | Mon May 07 11:09:49 EDT 2007 | davef
4 Fluxer Operation 4.1 Set-Up and Check-Out the Fluxer 4.1.1 Spray Fluxer Set-Up and Check-Out 4.1.1.1 Pass a sample unsoldered board through the machine. 4.1.1.2 Remove the board just after passing through the fluxer and the air knife. 4.1.1.3
Electronics Forum | Thu Dec 04 12:24:35 EST 2008 | jdumont
We have the same Asymtek machine, same Humiseal product, same bubbling issue on touch ups. Ive found that very light pressure and a thinner mixture usually yields good results for us. Generally I dip the brush in the mixture and let it drip near wher
