Full Site - : bubbles in potting (Page 4 of 31)

Fully Automatic Vacuum Chamber Glue Potting Solution

Technical Library | 2021-12-06 03:43:31.0

By potting under vacuum, components can be optimally protected from external influences. Before the potting process, air and moisture are removed from the components by vacuum. Components with geometries that are difficult to vent, coils, transformers or wound goods can be potting free of air bubbles. Potting under vacuum guarantees an even distribution of the potting material.Whatsapp 0086 134 2516 4065

Guangzhou Daheng Automation Equipment Co.,LTD

PVA Patents Optical Bonding Software in Europe

Industry News | 2021-06-15 04:21:00.0

PVA today announced that it received a new patent for its optical bonding software in Europe. The patent is for the United Kingdom, France, Italy, Germany, Hungary, Portugal and Spain.

Precision Valve & Automation (PVA)

Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board

Technical Library | 2021-08-11 00:55:44.0

In this article, the influence of shrinkage tensile stress in potting materials on the anti-overload performance of a circuit board was studied. Firstly, the phenomenon of shrinkage tensile stress in common potting materials was analyzed, and it was found that the commonly used potting adhesives displayed large shrinkage characteristics. Secondly, a small experiment was set up to verify that the shrinkage tensile stress of potting adhesives would lead to printed circuit board (PCB) deformation, and the shrinkage stress was contrary to the acceleration direction of overload. Thirdly, the influence of potting adhesives on the overload resistance of the PCB was analyzed.

Nanjing University

Don't Miss the Leader in Solder Recovery – EVS in Booth 1100 at APEX

Industry News | 2022-12-14 12:27:18.0

EVS International is pleased to announce plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The EVS team will showcase the latest innovation in solder recovery in Booth #1100 – the EVS 11KLFHS.

EVS International

Koh Young to Showcase Award-winning Inspection and Smart Factory Solutions at SMTconnect on May 10-12, 2022, in Nuremberg, Germany

Industry News | 2022-04-28 14:30:28.0

Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will highlight an array of award-winning inspection and measurement solutions at SMTconnnect in booth 4.A-233 on the NürnbergMesse event grounds during 10-12 May 2022. The following is just a glimpse into what Koh Young will have in store for our visitors at the tradeshow:

Koh Young America, Inc.

Koh Young Highlighting its Award-winning Inspection Solutions at IPC APEX EXPO on April 09-11, 2024, in Anaheim, CA

Industry News | 2024-02-26 14:04:06.0

Koh Young invites electronics manufacturers to booth 2112 for live demonstrations of our award-winning inspection solutions. At the show, you can discover the future of inspection technology as Koh Young highlights innovative machines and smart factory software offerings, unveils new solutions to handle your toughest challenges and releases new software enhancements to make your life easier. We look forward to welcoming you to our booth at IPC APEX Expo in Anaheim, California 09-11 April 2024.

Koh Young America, Inc.

Potting-optimized component design

Technical Library | 2023-02-15 16:00:16.0

With regard to potting, the design of electronic assemblies and components has a significant impact on economical and sustainable production. Key aspects in this respect are pottability, material use, cycle times, quality and the process technology needed. Optimized, bubble-free potting contributes greatly to the function and longevity of products. It is best practice during the design and development phases therefore to follow the potting tips contained in this White Paper.

Scheugenpflug Inc.

1 Liter of Gap Filler in Only 13 Seconds - New Dispensing Solution for the Thermal Management for HV Batteries

Technical Library | 2018-06-18 13:43:56.0

Thermal influences can significantly compromise the service life, capacity and especially the operational safety of HV batteries. In order to prevent damage due to excessive temperatures, large quantities of heat-conducting potting media are used here. Scheugenpflug has developed a new system solution for fast and reliable application of these materials.

Scheugenpflug Inc.

Unicomp X-ray equipment are deployed in most semiconductor companies

Industry News | 2020-12-17 03:30:07.0

It has been 7 years since Unicomp Technology undertook the national "02" special project in 2013 to apply The X-ray non-destructive testing technology in the field of semiconductor packaging test.("02" special project is the project of Maximum Scale Integrated Circuit Manufacturing Technology and Complete Process)

Unicomp Technology Co., Ltd

PVA Receives Patent Optical Bonding Software in Korea

Industry News | 2021-11-24 15:28:48.0

PVA is pleased to announce that it has patented its optical bonding software in Korea. With the new patent, the software is patented throughout the US, United Kingdom, France, Italy, Germany, Hungary, Portugal and Spain, and now Korea.

Precision Valve & Automation (PVA)


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