New Equipment | Assembly Services
We can bump single die in geometries as small as 30um. CVI will add a UBM on aluminum and copper pads follewed by solder bump in Sn and In alloys. CVI can then attach the die to a substrate or PCB followed by complete assembly.
Industry Directory | Manufacturer
CVInc services advanced packaging. Placing solder bumps on single die, partial wafers, and complete wafers...we also offer RDL (redistribution) services in 5-7 working days. Our custom preforms are as small as 50um geometries.
Parts & Supplies | Pick and Place/Feeders
Product Description: Product Name: Philips smt feeder station(with power supply) Product Size (mm): L120*W230*H250 Brand:Philips Devices Number : Install one FEEDER Applicable models: Philips Series models Weight: About 6KG This product is ma
Industry Directory | Manufacturer's Representative
ASE is contract IC assembly and test manufacturer situated in Penang Malaysia. Establishing wafer bumping capability is one of key program for year 2001 which I am given the task to start and establish. I am in search of any relevant technical papers, studies, technical bulletin to wafer bumping.
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
MeltroniX Inc provides advanced microelectronics packaging services to the elecvtronics sector. Processes include chip and wire, flip chip, wafer bumping, SMT, and complete hybrid/MCM fabrication.
Parts & Supplies | Board Cleaners
LOT OF 4, UNDER SCREEN CLEANING FABRIC Screen cleaning Rolls are essential components in keeping stencil printing machines clean and effective. Individual manufacturers configure their systems differently to use specific sizes and designs of unde
Industry Directory | Consultant / Service Provider
Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)
.png)
