MeltroniX Inc provides advanced microelectronics packaging services to the elecvtronics sector. Processes include chip and wire, flip chip, wafer bumping, SMT, and complete hybrid/MCM fabrication.
Parts & Supplies | Board Cleaners
LOT OF 4, UNDER SCREEN CLEANING FABRIC Screen cleaning Rolls are essential components in keeping stencil printing machines clean and effective. Individual manufacturers configure their systems differently to use specific sizes and designs of unde
» Fully automated 200 / 300mm EFEM wafer capability » Patented vibration squeegee technology » Dual or Single load port available Milara takes its combined system technology practice one step further with the development of the new AWPb 300 Wafer Pri
» Combined system technology (wafer printer and wafer bumper) » Unsurpassed vibration squeegee printing technology » Robust design to ensure years of dependable operation The SemiTouch Wafer Printer / Bumper is an easy to use, highly robust semi-auto
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
Category Category Box Header 2.54mm(Bump) Circuits 10,14,16,20,24,26,30,34,40,50,60,64 Pitch 2.54mm Electrical Current Rating 3.0A AC(rms) Voltage Rating 250V AC(rms)/DC
Category Category Ejector Box Header 2.54mm(Bump) Circuits 10,14,16,20,24,26,30,34,40,50,60,64 Pitch 2.54mm Electrical Current Rating 1.0A AC(rms) Voltage Rating 250V AC(rms
Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and
New Equipment | Solder Materials
YINCAE is excited to announce that we have successfully developed a new No Clean Flux product - NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping a
