Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
Industry News | 2007-11-01 20:29:37.0
November 1, 2007 - Lloyd Doyle announces they will showcase the IBIS system, a brand new development for solder bump inspection, in Hall A1 Stand 347 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Used SMT Equipment | Pick and Place/Feeders
8mm, 12mm, 16mm, 24mm, 32mm, 44mm IQ ( Intelligent ) Surface Mount Tape Feeders and tape feeder reel arms for QUAD Q series and C series pick and place machines. These are the newer 8 pin, deep pocket, feeders and they will work on the newer intellig
Used SMT Equipment | Pick and Place/Feeders
60,000cph with a large component range of 0201 to 30mmx30mm. Flexible, high-speed productivity for medium volume environments. A powerful line booster solution or high-performance small part placer. Dual-beam, dual-drive overhead gantry system
Technical Library | 2013-04-11 15:43:17.0
With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in the field. One method of reinforcement has been the utilization of underfills to "glue" certain SMDs to the PCB. Bumped SMDs attached to the PCB with a no-clean soldering process offer the unavoidable scenario of the underfill coming in contact with a flux residue. This may or may not create a reliability issue... First published in the 2012 IPC APEX EXPO technical conference proceedings
New Equipment | Test Equipment - Bond Testers
Fully integrated solution for automated wafer testing (up to 300 mm). The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages av
Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging
Industry Directory | Consultant / Service Provider / Manufacturer
HEPCO, Inc. is the world's leading manufacturer of Component Lead Prep, BGA Reballing, and RoHS/WEEE & Lead-Free Testing Equipment.
Industry Directory | Manufacturer
The Company is dedicated to the development, manufacturing, servicing and/or licensing of manual, semi automatic and automatic stencil/screen printers, dispensers, and wafer printers for the Surface Mount Technology (SMT) and Semiconductor Industries
New Equipment | Rework & Repair Equipment
Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos
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