Electronics Forum: bumper-pak (1)

QFN Recognotion Problem

Electronics Forum | Tue Apr 03 08:53:07 EDT 2007 | namruht

Thanks for the help everyone. I think that the pattern instead of a leaded component is going to have the best results. Also I checked on the software update and there is not any component database differences between the newest and my current versio


bumper-pak searches for Companies, Equipment, Machines, Suppliers & Information

Sm t net
  1  
SMT feeders

Reflow Soldering 101 Training Course
Blackfox IPC Training & Certification

Wave Soldering 101 Training Course
2024 Eptac IPC Certification Training Schedule

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications