BEST manufactures and designs SMT stencils-both metal and plastic film type. This video demonstrates our metal stencil laser. See more on stencils here: http://www.soldertools.net/categories/Metal-Stencils/
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
Industry Directory | Manufacturer
Ball Grid Array IC Reconditioning, Re-Ball Service, BGA IC Purchase and Resale
New Equipment | Assembly Services
We can bump single die in geometries as small as 30um. CVI will add a UBM on aluminum and copper pads follewed by solder bump in Sn and In alloys. CVI can then attach the die to a substrate or PCB followed by complete assembly.
Industry Directory | Manufacturer
CVInc services advanced packaging. Placing solder bumps on single die, partial wafers, and complete wafers...we also offer RDL (redistribution) services in 5-7 working days. Our custom preforms are as small as 50um geometries.
Industry Directory | Manufacturer's Representative
ASE is contract IC assembly and test manufacturer situated in Penang Malaysia. Establishing wafer bumping capability is one of key program for year 2001 which I am given the task to start and establish. I am in search of any relevant technical papers, studies, technical bulletin to wafer bumping.
Parts & Supplies | Pick and Place/Feeders
Product Description: Product Name: Philips smt feeder station(with power supply) Product Size (mm): L120*W230*H250 Brand:Philips Devices Number : Install one FEEDER Applicable models: Philips Series models Weight: About 6KG This product is ma
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
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