The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
Industry Directory | Manufacturer
SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.
QFN stenicl bumping process demonstrated using a polyimide stencil. This process is one in which a stencil is used to the bump the bottom terminations of a leadless device making it simple to place without voiding of the the thermal pac or shorting o
» Fully automated 200 / 300mm EFEM wafer capability » Patented vibration squeegee technology » Dual or Single load port available Milara takes its combined system technology practice one step further with the development of the new AWPb 300 Wafer Pri
» Combined system technology (wafer printer and wafer bumper) » Unsurpassed vibration squeegee printing technology » Robust design to ensure years of dependable operation The SemiTouch Wafer Printer / Bumper is an easy to use, highly robust semi-auto
During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. Cleaning the cavities is very difficult and small ball cavities can be damaged easily. XYZTEC ha
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and
Used SMT Equipment | Chipshooters / Chip Mounters
Dear All , We currently have 3 units YSH20 available in our stock, if you have any interesting, please contact me. Applicable PCB L50 x W30 to L250 x W200mm ****Up to L340 x W340mm" is applicable. Please contact us separately. Mounting c
Through a unique design, the WS-2000 provides both bump metrology measurement and defect detection using a powerful combination of 2-D and 3-D inspection technologies.
