Industry Directory | Manufacturer
The Company is dedicated to the development, manufacturing, servicing and/or licensing of manual, semi automatic and automatic stencil/screen printers, dispensers, and wafer printers for the Surface Mount Technology (SMT) and Semiconductor Industries
Technical Library | 2013-04-11 15:43:17.0
With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in the field. One method of reinforcement has been the utilization of underfills to "glue" certain SMDs to the PCB. Bumped SMDs attached to the PCB with a no-clean soldering process offer the unavoidable scenario of the underfill coming in contact with a flux residue. This may or may not create a reliability issue... First published in the 2012 IPC APEX EXPO technical conference proceedings
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Industry News | 2002-05-06 10:10:04.0
Camtek has received acceptance for a Bump Inspection System (BIS) from one of the world's leading semiconductor companies.
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
New Equipment | Solder Paste Stencils
NiEX™ electroformed stencils use the same proprietary process as our market leading AMTX™ stencils. The NiEX™ stencil has a higher Knoop Hardness (HK) than our standard AMTX product for those very thin less than .003 applications such as wafer bumpin
Used SMT Equipment | Repair/Rework
SRT (Sierra Research and Technology) Summit 1100 Automated Workstation Vintage: August 2000 Voltage: 208V Single Phase Includes (2) Computers and (1) Flatscreen Display The Summit 1100 is a semi-automated system for prototyping, light
