New Equipment | Board Handling - Storage
PROMATION offers a servo driven "Extend to Deliver" passageway shuttle station. The shuttle gate provides a normally open pathway (800 mm) and extends to deliver product when available. The shuttle gate uses 3 look across sensors and bump detection
Career Center | Brookfield, Wisconsin USA | Engineering
SR. ENGINEER � SENSORS -- $60-$80K Company: Well established controls manufacturer that has seen steady growth over the past several years. This company has a history of anticipating and successfully capitalizing on new market needs. Being one of t
Technical Library | 2016-01-12 11:04:35.0
3D packaging has recently become very attractive because it can provide more flexibility in device design and supply chain, reduce the gap between silicon die and organic substrate, help miniaturize devices and meet the demand of high speed, provide more memory, more function and low cost. With the advancement of 3D packaging, the bump height is now down from 80μ to 10μ. When the bump diameter is 20-40μ and height 10μ, the process and reliability are obvious issues. It is well known that underfill can enhance the reliability for regular flip chip, however underfill won’t help assembly process. In order to resolve some difficulties that 3D packaging faces, YINCAE Advanced Materials, LLC has developed solderable anisotropic conductive adhesives for 3D package applications. In this paper we will discuss the assembly process and reliability in detail.
Technical Library | 2018-01-17 22:47:02.0
Fine pitch copper (Cu) Pillar bump has been growing adoption in high performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities, thus assembling such packages using a standard mass reflow (MR) process and maintaining its performance is a real and serious challenge. (...) In this study a comprehensive finding on the assembly challenges, package design, and reliability data will be published. Originally published in the SMTA International 2016
Technical Library | 2021-04-21 15:10:16.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
Technical Library | 2022-10-31 18:35:40.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
Technical Library | 2018-11-14 21:43:14.0
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Finally, the competition on flip chip technology will be briefly mentioned.
Industry Directory | Manufacturer
Founded in 1992, LaserJob specializes in laser-cut stencils for printed circuit boards used in electronic devices.
Industry Directory | Consultant / Service Provider / Manufacturer
The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.
