Electronics Forum | Fri Feb 18 09:12:13 EST 2000 | Leslie Hall
Thanks Dave F for you 2 cents. You bring up some important points that what one person is doing isn't neccesary right for us. Someone might burn in their boards for 10 hours in temperature but their ramp time is only an hour versus someone else is
Electronics Forum | Fri Feb 11 10:37:54 EST 2000 | Leslie Hall
I'm trying to find out what is considered a standard or what other companies are doing to test their cuircuit boards. Is everyone using a envirmental room if so what is the ramp up and how long do you test it? Thanks
Industry News | 2010-05-26 13:06:11.0
BANNOCKBURN, Ill., USA — In communications sent to Members of the European Parliament (MEPs) last week, IPC — Association Connecting Electronics Industries® lent its support to the adoption of RoHS Directive proposed amendments 197 through 203. These amendments support the use of a rigorous scientific methodology to evaluate additional restricted substances and their alternatives.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Technical Library | 2021-12-29 19:52:50.0
Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.
Technical Library | 2019-05-06 23:04:05.0
The temperature and humidity test chamber simulate the temperature and humidity, so there are a lot of things customers shoud notice in the process of use, although there is detailed instruction when purchasing the equipment. But some users just know how the device works and start using it. This is very easy to cause problems in the use of the equipment, so Symor intends to describe the safety details during the use of temperature and humidity chamber. 1. Before the test, determine if the sample contains flammable and explosive substances to avoid combustion or explosion during the test. Of course, also make sure there is no flammable and explosive material around the test equipment, otherwise it may cause fire and other accidents. 2, Do not open the chamber door to operate during the experiment, or the gas in the studio may cause the operator to burn and so on. 3. At the end of the test or at the time of regular cleaning of the test chamber, power off the equipment to avoid electrocution accidents. Also, when cutting off the equipment power, pull the power cord to pull out the plug, otherwise it may lead to a rupture of the power cord and so on. You can contact manufacturers if there are some places you donnot understand, do not dismantle and repair the temperature and humidity test chamber without authorization, otherwise it may lead to more serious problems.
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-in-the-internet-of-things-iot/
. PCB prototype providers may also conduct various tests to verify the quality and functioning of a PCB design and assembly. These include in-circuit testing, flying probe tests, and burn-in testing
| http://etasmt.com/cc?ID=te_news_industry,24565&url=_print
. Burn-in a test board with thermal shock and mechanical shock to check the board’s reliability. Compare real-time thermal data with the virtual profile
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