New Equipment | Rework & Repair Equipment
Quantity Included in Kit Description 3 Resin/Hardner, 2gms with divider 5 Popsicle sticks for clamping down for PCB repairs, 10 count 5 Orange sticks for mixing, 10 count 1 Swaging tool for through h
New Equipment | Cleaning Agents
CYBERSOLV® C8508 is the latest generation spray cleaner for reflow ovens and general equipment maintenance cleaning. CYBERSOLV® C8508 has been tested on the toughest baked on flux residues with great success and has proven effective on the latest lea
Electronics Forum | Wed Sep 08 11:30:49 EDT 2021 | kumarb
We can vouch that UTSOURCE was excellent in assisting in the repair of some obscure farm equipment for a local farmer. Their Hitachi (original) LCD display driver was blown on a number of PCBs but was able to source the replacements through this port
Electronics Forum | Tue May 30 21:14:31 EDT 2000 | Dave F
Sal: JAX makes good points, but I�d like to think about this differently. It sounds like the poorly soldered connection is lifting the whole connector, so that termination floats on top of the solder, rather than submit to the wetting force and be
Industry News | 2017-10-05 05:56:21.0
The SMTA Capital Chapter is pleased to announce its third meeting of 2017 on November 7th, scheduled from 5:30 pm to 8:00 pm at ZESTRON Americas, 11285 Assett Loop, Manassas, VA, 20109. Ravi Parthasarathy, Senior Application Engineer, ZESTRON Americas, will present “Cleaning Before Conformal Coating” and “pH Neutral Cleaning Agents - Market Expectation and Field Performance”.
Industry News | 2021-12-27 20:26:21.0
When speaking of air conditioners, everyone is familiar with them. Especially in the hot summer, we would not know how to live without it. But when it comes to refrigeration compressors, many consumers are not particularly clear. In fact, the refrigeration compressor is an important part of air conditioners and refrigerators, and its performance and quality directly determine the cooling effect of them. The following is an introduction to the types of refrigeration compressors.
Parts & Supplies | Soldering - Reflow
Brand New SMT2010 TABLE-TOP REFLOW OVEN LEAD-FREE Description: This is a brand new, SMT2010 Reflow oven. More and more surface mount devices (SMD) are used on electronic circuit boards. Large floor model reflow ovens are expensive and heavy, no
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Register for the webinar today:https://pages.zestron.com/cleaning-with-ph-neutral-chemistry-background-applications-and-benefits The greater use of lead-free solder paste and the required higher reflow profiles have resulted in more difficult to re
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-tell-if-a-printed-circuit-board-is-bad/
. When boards are not designed to work around high heat, components can be burnt and rendered nonfunctional. In these cases, boards cannot be repaired and must be replaced. Heat
| http://etasmt.com/cc?ID=te_news_bulletin,21161&url=_print
. If it is too fast, thermal shock will occur, and both the circuit board and components may be damaged; if it is too slow, the solvent will evaporate
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