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Industry News | 2014-01-29 02:29:02.0
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will debut its new SMT production centre in booth #851 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and mount components in one machine.
Industry News | 2014-02-19 16:09:53.0
Essemtec will debut its new SMT production centre in booth #851 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2019-08-17 12:52:01.0
Shingle Springs, CA — August 2019 — PDR, a leading manufacturer of BGA rework systems, test, and inspection equipment since 1985, is pleased to announce that it has entered into a formal agreement with Pacific X-ray Imaging (PXI) for the exclusive distribution of industrial X-ray products under the PDR brand name.
Industry News | 2012-08-28 08:13:26.0
NEPCON South China 2012 kicked off today at the Shenzhen Convention & Exhibition Center.
Industry News | 2016-05-13 11:56:03.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2016-05-13 12:00:12.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Valor Computerized Systems
