New SMT Equipment: c-100 (24)

Mitsubishi USB programming cables

New Equipment |  

USB-SC09 USB-SC09+ USB-SC09-FX USB-QC30R2 USB-FX232-CAB-1 USB- AC30R2-9SS GT09-C20USB-5P SC-09(??) SC-09(??) SC-09(??) SC-11 QC30R2-3M FX-20P-CAB0-3M FX-20P-CAB0-4M FX-20P-CAB0-5M FX-20P-CAB F2-232CAB-1 FX-422CAB0 FX-422CAB FX-232-

Zhengzhou Weilin Electronic Technology Co.,ltd

PCBA Conveyor with Lamp

PCBA Conveyor with Lamp

New Equipment | Board Handling - Conveyors

Apply The PCB Conveyor is used in the PCB assembly line when frequent visual inspection of PCBs is required, can be used as an Inspection conveyor or a Linking conveyor.  Features 1.       PLC Control system. 2.       All aluminum framework

HuiKe Tech

Electronics Forum: c-100 (14)

Stencil Rolls

Electronics Forum | Tue Jun 07 03:47:51 EDT 2005 | vera

hi solcom: kindly check the http://www.hkenterprise.com/szcomfaje we sell the stencil roll: 1)suited for machine:MPM,DEK,JUKI,ERKA,Minami etc. brands. 2)paper type:68g(C1,suitable for dry uses),60g(C100),55g,50g,40g(C60,suitable for vacuum absorbent

Rainbow bridge

Electronics Forum | Fri Sep 15 05:48:24 EDT 2000 | carsonho

Have any experience that Sn/Pb plated integrated circuit products will appear some rainbowbridge-like substance after exposing at conditions of 121degC, 100%RH and 15psi for 48hours or above? The rainbow bridge substance was analyzed by EDAX and fou

Used SMT Equipment: c-100 (17)

Agilent 8711C-100

Agilent 8711C-100

Used SMT Equipment | In-Circuit Testers

Agilent 8711C-100 Agilent/HP 8711C Network Analyzer, 300 kHz to 1.3 GHz The HP Agilent 8711C is a Network Analyzer with a 300 kHz to 1.3 GHz range. Product Specs:     Frequency Range of 300kHz to 1.3GHz     System dynamic range is better t

Test Equipment Connection

Agilent 8711C-100

Agilent 8711C-100

Used SMT Equipment | In-Circuit Testers

Agilent 8711C-100 Agilent/HP 8711C Network Analyzer, 300 kHz to 1.3 GHz The HP Agilent 8711C is a Network Analyzer with a 300 kHz to 1.3 GHz range. Product Specs:     Frequency Range of 300kHz to 1.3GHz     System dynamic range is better t

Test Equipment Connection

Parts & Supplies: c-100 (26)

Contact Systems Allen Bradley 100S-C09EJ404C Safety Contactor 24VDC Original new

Contact Systems Allen Bradley 100S-C09EJ404C Safety Contactor 24VDC Original new

Parts & Supplies | Assembly Accessories

Other models: 100Q-C16ZJ20 100Q-C37A20 100Q-C37D11 100Q-C37D20 100Q-C37DJ11 100Q-C37DJ20 100Q-C37E11 100Q-C37EJ11 100Q-C37F11 100Q-C37KA20 100Q-C37KB11 100Q-C37KF11 100Q-C37KF20 100Q-C37KG11 100Q-C37KJ11 100Q-C37KL11 100Q-C37KP11 100Q-C37KY11 100Q-

KingFei SMT Tech

Technical Library: c-100 (2)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Technical Library | 2015-01-05 17:38:26.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Rockwell Collins

Videos: c-100 (171)

universal gold plus feeder , feeder tranfer cart , feeder bank assy

universal gold plus feeder , feeder tranfer cart , feeder bank assy

Videos

we have many hitachi equipment and hitachi feeders to sell . if you want to know more , please contact us tina@smtfeeders.cn

Shenzhen Zhi Honglai Trading Co.,Ltd

universal feeders and feeder tranfer carts

universal feeders and feeder tranfer carts

Videos

we have many universal gold plus feeders to sell . www.smt-store.com

Shenzhen Zhi Honglai Trading Co.,Ltd

Express Newsletter: c-100 (1)

Partner Websites: c-100 (1666)

JUKI Conveyor Belt C E2188721000 | QYSMT

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/e2188721000-conveyor-belt-c-151990?page=100&category=1119&order=name+desc

JUKI Conveyor Belt C E2188721000 | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products JUKI Conveyor Belt C Public Pricelist Public Pricelist Conveyor Belt C

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

LAC Spec sheet 03-20.indd

Baja Bid | https://bajabid.com/wp-content/uploads/2021/09/Despatch-LAC-Spec-Sheet.pdf

(40˚C to 100˚C) 9 minutes 6 minutes 6 minutes 7 minutes 5 minutes Time to temperature with no load (40˚C to 200˚C) 35 minutes 25 minutes 26 minutes 18 minutes 20 minutes Time to temperature with no load (40˚C to 260˚C

Baja Bid


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