Industry News | 2024-06-17 12:17:15.0
Nordson TEST & INSPECTION today announced plans to exhibit at SEMICON West 2024, scheduled to take place July 9-11 at the Moscone Center in San Francisco, California. Visitors to booth 1233 will have the opportunity to see demonstrations of Nordson's WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), and Gen 7™ Acoustic Micro Imaging (AMI) system. Additionally, the innovative SpinSAM™ AMI system will be unveiled in a video presentation for the first time at the show.
Industry News | 2016-06-27 14:45:26.0
Datest today announced that it has passed its recertification audit for its dual ISO9001 / AS9100C Certification. Datest is the only U.S. test engineering and test services company that has earned dual ISO/AS9100 Certification as well as ITAR Registration. The dual recertification is emblematic of Datest’s success and relentless drive to provide quality PCBA testing and inspection solutions to a discerning, engineering-based clientele. Both certifications are recognized and respected throughout the world as symbols of expertise, professionalism and general process control. AS9100 certification is often viewed as a prerequisite to aerospace manufacturing certification and AVL approval.
Industry News | 2024-09-09 17:41:41.0
Nordson TEST & INSPECTION today announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The event will take place from September 4-6, 2024 at TaiNEX Hall 1 and 2, Taipei, Taiwan. In booth #L0516, the company will be showcasing its state-of-the-art inspection and metrology solutions, including the Quadra 7 Pro Manual X-ray Inspection (MXI) System, the new SpinSAM Acoustic Micro Imaging (AMI) system and the Gen 7 AMI system. The company will also demonstrate the WaferSense® Auto Teaching System™ (ATS2) for semiconductor tool set-up and maintenance.
Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a
C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Thu Aug 11 08:23:29 EDT 2005 | jbragg
Hi Peter, I'm not sure where you're located, but I work for Celestica in our Component Failure Analysis and Reliability Testing Lab in Toronto Ontario Canada. We are an idenpendent lab with full FA component, assembly and PWB capabilities and would
Electronics Forum | Thu Jun 20 15:50:04 EDT 2002 | dason_c
Dave mention b/4 to me, we don't have any industrial standard for the BGA rework. One of my customer request us to bake at 125C for 6 hours b/4 rework. I am lucky and we don't have the component which you are using. I did a evaluation and we found
Electronics Forum | Tue Jul 02 09:29:08 EDT 2002 | dason_c
Ian, First, I baked the parts at 125C for 48 hours and check the weight Second, I soaked the parts above 30C and 60% for 96 hours and check the weight Calculate the weight gain, suppose only moisture add to the parts during soaking, say a Third, dry
Electronics Forum | Tue Aug 23 13:25:10 EDT 2005 | MMurison
MUAnalysis is an independent lab for Component Failure Analysis and Reliability Testing in Ottawa, Ontario Canada. We also would be pleased to discuss your analysis needs. We also perform all non-destructive testing, e.g. visual, x-ray, C-SAM, el
Electronics Forum | Tue Jul 02 17:09:02 EDT 2002 | dason_c
Francois, thank you very much for your recommendation twice. Is it any harmful for my evaluation? The component will go thro the reflow after drying process and not just only check the weight. The evaluation will go thro the C-SAM as Dr. Shook doc
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