Industry News | 2021-09-02 05:46:58.0
The Assembly Division of MacDermid Alpha Electronics Solutions will present the paper "Solder Paste for Interconnecting Structured Ribbons on the Back Side of the c-Si Cells" at the upcoming virtual European PV Solar Energy Conference and Exhibition which takes place from the 6th-10th September 2021.
Industry News | 2010-05-12 13:12:33.0
Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-228.pdf
. By Marc Peo and Don DeAngelo 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 300 200 100 0 Minutes (slope degree/second) C el si u s Lead-free Profile Figure 2
ORION Industries | http://orionindustries.com/pdfs/nomex410.pdf
) at 60 Hz (x 10-3) 6 6 11 at 1 Hz (x 10-3) 13 14 25 Volume resistivity3) (Ohm.cm) 6x1016 2x1016 2x1014 ASTM D-257 Temperature, °C D is si pa tio n fa ct or ASTM D-150 Temperature
