USB-SC09 USB-SC09+ USB-SC09-FX USB-QC30R2 USB-FX232-CAB-1 USB- AC30R2-9SS GT09-C20USB-5P SC-09(??) SC-09(??) SC-09(??) SC-11 QC30R2-3M FX-20P-CAB0-3M FX-20P-CAB0-4M FX-20P-CAB0-5M FX-20P-CAB F2-232CAB-1 FX-422CAB0 FX-422CAB FX-232-
New Equipment | Board Handling - Conveyors
Apply The PCB Conveyor is used in the PCB assembly line when frequent visual inspection of PCBs is required, can be used as an Inspection conveyor or a Linking conveyor. Features 1. PLC Control system. 2. All aluminum framework
Electronics Forum | Tue Jun 07 03:47:51 EDT 2005 | vera
hi solcom: kindly check the http://www.hkenterprise.com/szcomfaje we sell the stencil roll: 1)suited for machine:MPM,DEK,JUKI,ERKA,Minami etc. brands. 2)paper type:68g(C1,suitable for dry uses),60g(C100),55g,50g,40g(C60,suitable for vacuum absorbent
Electronics Forum | Fri Sep 15 05:48:24 EDT 2000 | carsonho
Have any experience that Sn/Pb plated integrated circuit products will appear some rainbowbridge-like substance after exposing at conditions of 121degC, 100%RH and 15psi for 48hours or above? The rainbow bridge substance was analyzed by EDAX and fou
Used SMT Equipment | In-Circuit Testers
Agilent 8711C-100 Agilent/HP 8711C Network Analyzer, 300 kHz to 1.3 GHz The HP Agilent 8711C is a Network Analyzer with a 300 kHz to 1.3 GHz range. Product Specs: Frequency Range of 300kHz to 1.3GHz System dynamic range is better t
Used SMT Equipment | In-Circuit Testers
Agilent 8711C-100 Agilent/HP 8711C Network Analyzer, 300 kHz to 1.3 GHz The HP Agilent 8711C is a Network Analyzer with a 300 kHz to 1.3 GHz range. Product Specs: Frequency Range of 300kHz to 1.3GHz System dynamic range is better t
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Parts & Supplies | Assembly Accessories
Other models: 100Q-C16ZJ20 100Q-C37A20 100Q-C37D11 100Q-C37D20 100Q-C37DJ11 100Q-C37DJ20 100Q-C37E11 100Q-C37EJ11 100Q-C37F11 100Q-C37KA20 100Q-C37KB11 100Q-C37KF11 100Q-C37KF20 100Q-C37KG11 100Q-C37KJ11 100Q-C37KL11 100Q-C37KP11 100Q-C37KY11 100Q-
Parts & Supplies | General Purpose Equipment
YAMAHA Q2AA04010DXS2C 100W AC200V 1.1A 3000 SANYODENKI MOTOR
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2015-01-05 17:38:26.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
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