Electronics Forum | Thu Jun 18 22:25:24 EDT 1998 | Dave F
| | | | | We're running into problems with board damage (broken traces, solder shorts) due to pliers and other bizarre tools being used for depanelization. I need some sort of fixture for this. A delrin plate with a slot cut to the correct depth and
Electronics Forum | Wed Apr 05 13:59:56 EDT 2000 | Kal C.
Hi Emmanuel, There is lots of info. in SMTNet archive (I think 98 Sept-Dec). I had a lot of problem with PBGA and certain uBGA with their PCB base material (FR-X) and encapsulant. Wolfgang is correct. We had to reprofile our reflow oven , qualify an
Electronics Forum | Thu Sep 16 09:29:13 EDT 1999 | Rob Jankowski
| | | Looking for a manual machine to de-panel with the panels held by 60mm tabs. Each panel hold multi-boards consisting of different shapes and sizes. Scoring is apparently not an option and volume does not dictate a large scale machine. | | | |
Electronics Forum | Thu Sep 16 09:31:05 EDT 1999 | Rob Jankowski
| | | | Looking for a manual machine to de-panel with the panels held by 60mm tabs. Each panel hold multi-boards consisting of different shapes and sizes. Scoring is apparently not an option and volume does not dictate a large scale machine. | | |
Electronics Forum | Wed May 10 12:13:16 EDT 2006 | scombs
We have a 6 up panel with a 1206 part .082" from the board scoreline. After depanelization when we run the board through ICT it fails for a short at that location. We have visually inspected at high magnification for any cracks in the body and at the
Electronics Forum | Wed Aug 08 17:50:22 EDT 2007 | flipit
X7R >Z5U,Y5V Greater means less likely to crack or in other words NP0 is better than X7R for crack resistance. Don't think that there is a set formula. There isn't! I cracked ceramic resonators at 0.050" from the board edge with CAB M2 and M3 dep
Electronics Forum | Thu Aug 16 13:00:32 EDT 2007 | russ
Here is what you need to do if you can, Since you want to shporten the bake time you need to increase temp. weigh a board prior to your current bake process (you need very hi resolution scale for this) weigh the same board after current process a
Electronics Forum | Mon Jun 02 15:03:05 EDT 2014 | clydestrum
Background on the PCB: Thickness: .032" Material: Standard Fr4 V-score: Leaves .016" (approx .008" cuts on either side) We are having some issues on these boards where the edges are delaminating all the way to the copper during de-panel. Now, we are
Electronics Forum | Thu Apr 13 20:18:14 EDT 2000 | Dave F
Pete: What�s a "free issue PCB panel"? Is that like "consigned material" here in the states? In response to your question, several possible approaches (in no particular order): 1 Router approach: 1a Wood working router * Go over to Sears and buy a
Electronics Forum | Wed Dec 22 12:21:51 EST 1999 | Dave F
Jake: This'll get you started: 1 Read the archives 2 primary approaches to paneling are; * Moise bites * Singulation * Routing * Scoring * Shearing 3 Major depaneling technologies are: * Singulation (Wand 708.459.2400fax2421, Circuit Technolo
