Used SMT Equipment | Pick and Place/Feeders
Brand: FUJI Name: FUJI Scalble Placement Platform NXT Ii Module Width: 320mm Machine Dimensions: L：1295mm（M3 II×4, M6 II×2） Lntelligent Feeders: Support For 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, And 104 Mm Wide Tape Trays: Applicable Tr
Technical Library | 2019-12-05 13:30:46.0
Conformal coatings are regularly employed to protect the surface of a soldered printed circuit board assembly from moisture, chemicals in the PCBA's service environment, and foreign objects or debris. Conformal coatings are nonconductive and therefore cannot be placed on any location where electrical contact will be required, such as connector pins, test points, and sockets. Conformal coatings are also not permitted on any mechanical interface location, such as mounting holes or brackets, to assure the proper fit between items in the final assembly. In order to apply conformal coatings to an assembly and comply with the restrictions on keep-out areas, masking is employed to protect those surfaces.
New Equipment | Coating Equipment
ASCEN Conformal coating spray equipment provide a is a high-performance film as a protective layer for PCB from the environment, enabling the board to withstand more moisture thereby increasing its surface resistance. It is because of this
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
New Equipment | Coating Equipment
Conformal coating LED panel by ASCEN conformal coating equipment, this thin-film PCB surface coatings that protect the components without affecting their light transmission or optical properties. These conformal coatings shield the conducti
New Equipment | Coating Equipment
selective conformal coating by machine that is the most efficient way of coating a PCB.Choose the selective PCB conformal coating system allows the user to ‘select’ which areas of the board needs to be coated, the required
link: https://www.ascen.ltd/Products/conformal_coating_equipment/ ASCEN designs and manufacturers pcb conformal coating machine for the printed circuit board industry.surface conformal coating equipment include selective coating,brush coating, aeroso
New Equipment | Coating Equipment
Select Coat conformal coater is being rampantly used in various industries like the automotive, aviation, marine and medical. An efficient PCB protection will have good electrical characteristics, low moisture permeability, good chemical resista
Technical Library | 2020-03-09 10:50:17.0
A customer called the Helpline seeking advice for cleaning no-clean fluxes prior to applying a conformal coating. The customer's assemblies were manufactured with a no-clean rosin based solder paste (ROL0) and were cleaned with an isopropyl alcohol (IPA) wash. After cleaning, a white residue was sometimes found in areas with high paste concentrations and was interfering with the adhesion of the conformal coating (Figure 1). For conformal coatings to adhere properly, the printed circuit board (PCB) surface must be clean of fluxes and other residues. In addition, ionic contamination left by flux residues can lead to corrosion and dendrite growth, two common causes of electronic opens and shorts. Other residues can lead to unwanted impedance and physical interference with moving parts.
Technical Library | 2020-04-14 15:49:38.0
The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has resulted in less THT (through-hole technology) and leads with a finer pitch. For this reason, the soldering of these components has also changed from wave soldering to Point-to-point selective soldering. Soldering these small, fine-pitch components is a challenge when surface mount components (SMD) are positioned very close to THT components on the PCB layout. This study, done in cooperation with a large automotive EMS customer, defines the process windows for through-hole technology for fine-pitch components. It determines what is feasible to solder and defines layout design parameter that make soldering possible with SMD areas and other components on the assembly.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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