Electronics Forum | Wed Aug 16 03:04:50 EDT 2000 | rberry
Hi Does anyone have a tried and tested method of estimating the mass of solder paste that will be used for an SMD assembly given only the type and quantity of components used. (As well as type of paste, stencil thickness etc) In other words is there
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2021-12-26 20:13:58.0
1. Reasons of High Temperature Breakdown 1.1 Environmental Factors Ambient temperature may not be the main cause of high temperature shutdown, but it is often the inducement of compressor high temperature shutdown. Generally, technicians have a design operating environment temperature (30-40 ℃) when designing compressors. When the air compressor is operated under the designed operating environment temperature, its maximum temperature is close to the protection temperature of the air compressor.
Technical Library | 2008-10-01 14:02:27.0
This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective areas and patterns. A system to obtain homogeneity of the solid-fluid mix is described and results are shared.
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