Electronics Forum | Mon Aug 27 08:58:24 EDT 2012 | rway
Reese, > > We would agree about the value of an > ICT system, in a general manufacturing > environment. However, a couple of notes > apply: > > 1. ICT isn't a catch-all, either, and > should be used to verify the process, not > validate it.
Electronics Forum | Fri Jun 10 17:28:51 EDT 2011 | aoiguy
So I actually tried that method as well. Took the P&P info that was provided to us in Mils, put together an excel formula sheet which converted all X,Y to mm which the aoi uses. Then came to the horrible conclusion that there was something in the cad
Electronics Forum | Tue Aug 10 09:09:39 EDT 2004 | mattkehoe
wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe
Electronics Forum | Sat Apr 17 12:00:12 EDT 1999 | John W
| | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | I consider "fines" individual unmelted metal spheres t
Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau
| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph
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