Electronics Forum | Mon Mar 22 18:03:15 EST 1999 | Marc
| | | | | Hi folks, | | | | | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diamet
Electronics Forum | Tue May 19 10:23:06 EDT 1998 | Mike C
| Howdy Richard, | Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) | I know it's not funny to be in that position, but there's so many different places t
Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach
| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and
Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon
| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a
Electronics Forum | Wed May 27 11:19:34 EDT 1998 | Earl Moon
| | | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered
Electronics Forum | Fri Feb 13 09:17:11 EST 2004 | Kris
we are worried about the coating not being able to cover underneath the BGA. If the coat is excessive then it would cause CTE issues. Also if anybody has data on 85/85, 1000 hrs after conformal coating of BGA, would appreciate if you guys can share
Electronics Forum | Wed Jan 17 03:52:20 EST 2007 | Vladimir
Hi, I am process engineer of SMT production. We have some strange problemn with tantalum capacitors. 1 case: If tantalum capacitor placed near BGA and one of his legs is connected to one of the BGA balls, after reflow we can see short between two or
Electronics Forum | Thu May 01 10:51:09 EDT 2008 | realchunks
You need a paste designed specifically for this. They are available. Most have 2% silver in them and higher temp flux so you can reflow at "no-lead" temps. The silver aids in the intermaetalic bond and the high temp flux allows you to reflow the n
Electronics Forum | Wed Feb 28 03:57:46 EST 2001 | peterbarton
Are you using a water based flux? Are the solder balls mainly around or near non-plated holes or near the edges of the PCB? If so the preheat must be set so the water content of the flux is fully evaporated before the board hits the solder wave. If
Electronics Forum | Wed Oct 11 10:29:28 EDT 2000 | G. English
Try the following steps : FIRST CHECK THE ARCHIVE for further information, it WILL help you. Step One : What�s the chemical analysis of this white res? Obtain a sample. It could be tin, rosin, or something else??? Step Two : The fastest way I know
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