Industry News | 2021-08-30 16:05:36.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2021-09-13 14:27:01.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality
Industry News | 2021-09-28 18:05:15.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2021-10-11 15:51:16.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2022-03-14 20:10:55.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2022-04-04 19:21:58.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2014-03-13 11:57:36.0
What does it take to make it to 80 years in an industry where today's technology is obsolete tomorrow? For Indium Corporation, it takes foresight and dedication.
Industry News | 2022-04-13 09:49:32.0
Indium Corporation's Ross Berntson, President and COO, will deliver the keynote presentation at TestConX, to be held May 1-4, in Mesa, Ariz., US.
Industry News | 2023-08-07 10:26:45.0
ZESTRON is pleased to announce an upcoming webinar titled, "Tackling Flux Residues: Best Practices for Cleaning Power Electronics Components," on August 17th, 2023, at 2:00 PM EST.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
